Packaging Structure With Protruding Supporting Pads For Accurate Component Placement
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Solution Overview
Problem
The existing packaging process for electronic components is complex and prone to residual glue issues due to the use of peelable adhesive layers, which complicates the manufacturing process and can lead to inaccuracies in packaging.
Innovation Solution
A method involving a substrate with insulating and metal layers, where grooves and positioning pillars are formed to support electronic components, eliminating the need for adhesive layers by using protruding portions of supporting pads to secure and encapsulate the components on both sides, thereby simplifying the process and improving accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a peelable adhesive layer is used to support electronic components during encapsulation, then the components can be held in place, but the manufacturing process becomes complicated and residual glue may remain
Solution Approach 1:
The patent extracts and removes the peelable adhesive layer from the packaging process. Instead of using adhesive to support components, the invention uses protruding portions of supporting pads that extend from the inner circuit board to directly support the electronic component, eliminating the adhesive layer entirely and simplifying the manufacturing process while avoiding residual glue issues
Solution Approach 2:
The patent introduces protruding portions of supporting pads as an intermediary structure between the inner circuit board and the electronic component. These protruding portions serve as a mechanical support medium that replaces the adhesive layer, providing component support through physical contact rather than adhesive bonding
2Reliability
If a peelable adhesive layer is used and then peeled off, then component support is achieved, but the process is complicated and time-consuming
Solution Approach 1:
The patent implements preliminary action by pre-forming the protruding portions of the supporting pads on the inner circuit board before component placement. These protruding portions are prepared in advance to provide immediate mechanical support when the component is placed, eliminating the need for subsequent adhesive application and peeling operations
Solution Approach 2:
The invention extracts and eliminates the time-consuming adhesive application and peeling steps from the manufacturing process by using permanently formed protruding supporting pad structures that provide component support without requiring any adhesive operations
3Ease of manufacture
If protruding portions of supporting pads are used to support electronic components, then the manufacturing process is simplified and residual glue is avoided, but precise positioning must be ensured
Solution Approach 1:
The patent applies local quality by designing the supporting pads with specific local features - protruding portions positioned at precise locations on the inner circuit board. These localized protruding structures provide both support and positioning functions, ensuring accurate component placement while maintaining manufacturing simplicity
Solution Approach 2:
The patent uses positioning pillars with different materials or visual characteristics to indicate precise positioning locations. The positioning pillars may have different heights, materials, or visual properties that help operators and automated systems accurately locate and place components at the correct positions
4Reliability
If electronic components are encapsulated on both sides, then complete packaging is achieved, but the process becomes more complex with traditional methods
Solution Approach 1:
The patent merges the support function and the two-sided encapsulation process into a single integrated operation. The protruding portions of the supporting pads provide component support while the outer circuit boards are bonded to both sides of the inner circuit board in one step, achieving complete packaging without requiring separate support removal and encapsulation steps
Data Source
AI summary
A packaging structure, includes: a dielectric layer; at least one inner wiring layer embedded in the dielectric layer; at least two outer wiring layers arranged two sides of the at least one inner wiring layer and combined with the dielectric layer; and at least one electronic component embedded in the dielectric layer; each inner wiring layer including at least two spaced supporting pads, and each supporting pad including a main body and a protruding portion extending outward from a periphery of the main body, the packaging structure further including at least two spaced positioning pillars, and each positioning pillar correspondingly connected to one main body, each electronic component arranged between at least two positioning pillars, and an end of each electronic component being in contact with protruding portions of at least two supporting pads, thereby packaging the electronic component accurately. The present invention also needs to provide a method for manufacturing the packaging structure.