Display Panel Circuit Board Structure for Pad Alignment and Dead Space
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Solution Overview
Problem
Current display devices face challenges in achieving optimal alignment and reducing dead space between the display panel and circuit board, leading to potential damage to conductive films and increased complexity in alignment processes.
Innovation Solution
The design includes a substrate with a display area and a pad area, where a circuit board with protrusion parts is directly attached to the display panel, using anisotropic conductive films to connect electrodes, and includes grooves to prevent damage to conductive particles, allowing for reduced alignment processes and minimized dead space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the circuit board is directly attached to the display panel, then alignment complexity is reduced, but dead space between components increases
Solution Approach 1:
The circuit board is divided into a protrusion part and a body part. The protrusion part extends toward the display area to reduce dead space, while the body part contains the main circuit components. This segmentation allows the circuit board to adapt to the display panel's shape while maintaining compact spacing.
Solution Approach 2:
The circuit board transitions from a flat two-dimensional structure to a three-dimensional structure with protrusion parts that extend toward the display area. This dimensional change enables better space utilization and reduced dead space while maintaining direct attachment to the display panel.
2Strength
If pressure is applied to bond pads to the circuit board, then bonding strength is improved, but conductive films may be damaged
Solution Approach 1:
An adhesive layer is applied between the circuit board and the display panel before bonding. This adhesive layer acts as a cushioning element that distributes the bonding pressure uniformly, preventing concentration of stress that could damage the conductive films while still achieving strong bonding.
Solution Approach 2:
The adhesive layer serves as an intermediary substance between the circuit board and the display panel. It mediates the bonding process by providing a compliant interface that protects the conductive films from direct mechanical stress while ensuring reliable electrical and mechanical connection.
3Manufacturing precision
If the circuit board overlaps the pad area, then alignment precision is improved, but risk of conductive film damage increases
Solution Approach 1:
The circuit board features a protrusion part with a specific shape that locally overlaps the pad area with precise alignment. This localized overlap ensures accurate electrical connection while the rest of the circuit board body remains positioned to minimize stress on the conductive films.
Solution Approach 2:
The circuit board's geometric parameters are optimized - the protrusion part has specific dimensions and positioning that enable precise alignment with the pad area. By carefully controlling these parameters, the design achieves accurate alignment while maintaining sufficient clearance to prevent conductive film damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances display quality by simplifying alignment, reducing dead space, and preventing damage to conductive films, thereby improving the structural integrity and efficiency of the display device.
Implementation Method 1
A first anisotropic conductive film is disposed between the plurality of first pad electrodes and the driving chip. The first anisotropic conductive film electrically connects the plurality of first pad electrodes and the driving chip to each other.
Data Source
AI summary
A display device includes a substrate including a display area and a pad area spaced apart from the display area. A driving chip is disposed on the substrate. The driving chip overlaps the pad area. A circuit board is disposed on the substrate. The circuit board includes a protrusion part overlapping an end of the pad area and a body part extending from the protrusion part away from the pad area.