Panel Device Turning Wire for Narrow Border Design
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Solution Overview
Problem
Existing panel device manufacturing technologies face challenges in producing stable lateral wires, which limits the yield and design flexibility, particularly in achieving narrow border or borderless designs for diversified applications.
Innovation Solution
A panel device is manufactured with a substrate having a conductor pad and a turning wire that extends from one surface to another, covered by a wire covering layer, allowing a circuit board to be bonded to the wire covering layer for electrical connection, thereby reducing the area required for bonding and enhancing design flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the circuit board is bonded to the first surface of the substrate, then the electrical connection is achieved, but the area available for functional elements is reduced due to border requirements
Solution Approach 1:
The patent applies dimensionality change by moving the circuit board bonding location from the first surface (2D plane) to the second surface of the substrate (different spatial dimension). The turning wire extends from the first surface through the substrate thickness to the second surface, enabling the circuit board to be bonded on the opposite side. This spatial reconfiguration eliminates the need for borders on the first surface while maintaining electrical connectivity through the three-dimensional wire path.
2Reliability
If traditional lateral wires are used for bonding, then the manufacturing process is simple, but the yield is low due to instability of lateral wires
Solution Approach 1:
The patent transitions from traditional lateral wires (horizontal routing on the same surface) to turning wires that extend through the substrate thickness (vertical routing to opposite surface). This dimensional change from 2D lateral connections to 3D through-substrate connections fundamentally improves wire stability by utilizing the substrate as a rigid support structure, while the wire covering layer provides additional mechanical protection.
Solution Approach 2:
The turning wire structure employs composite material design with a core wire (copper or aluminum) providing electrical conductivity, and an outer wire covering layer (insulating material) providing mechanical strength and stability. This composite structure enhances overall wire reliability compared to single-material lateral wires.
3Area of stationary object
If the border area is reduced for narrow border design, then the display area is increased, but the manufacturing precision requirements increase
Solution Approach 1:
By relocating the bonding interface to the second surface through the turning wire structure, the patent eliminates the need for precise lateral positioning of wires near the borders. The wire positioning precision requirement shifts from horizontal placement (affecting border width) to vertical routing through the substrate, which can be more easily controlled and does not constrain the display area.
Data Source
AI summary
A panel device including a substrate, a conductor pad, a turning wire, and a circuit board is provided. The substrate has a first surface and a second surface connected to the first surface while a normal direction of the second surface is different from a normal direction of the first surface. The conductor pad is disposed on the first surface of the substrate. The turning wire is disposed on the substrate and extends from the first surface to the second surface. The turning wire includes a wiring layer in contact with the conductor pad and a wire covering layer covering the wiring layer. The circuit board is bonded to and electrically connected to the wire covering layer. A manufacturing method of a panel device is also provided herein.