Parallel Configuration Interface for Multi-Die Programmable Logic
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Solution Overview
Problem
The complexity of tasks performed by programmable logic devices increases the need for high-speed interfaces to efficiently configure and reprogram these devices, particularly in applications like machine learning, video processing, and image recognition, where existing interfaces may not provide sufficient speed for efficient data transfer and processing.
Innovation Solution
A high-speed parallel interface is introduced, allowing for parallel data exchange between separate die in programmable logic devices, utilizing network-on-chip (NOC) circuitry to enhance bandwidth, implement design relocations, and provide security isolation, along with sector parallelism and pipelining to accelerate configuration and reconfiguration processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If traditional sequential interfaces are used for configuration, then device complexity is reduced, but configuration speed becomes too slow for complex computing tasks
Solution Approach 1:
The configuration interface is segmented into multiple parallel data paths, allowing simultaneous transfer of configuration data to different regions of the programmable logic device. This segmentation enables the system to achieve high-speed configuration by distributing the configuration load across multiple independent channels rather than using a single sequential interface.
Solution Approach 2:
The patent transitions from a one-dimensional sequential interface to a multi-dimensional parallel interface architecture. By adding spatial dimensions through multiple data paths and utilizing three-dimensional stacking with through-silicon vias, the system achieves exponential increases in configuration bandwidth while managing complexity through structured organization of these additional dimensions.
2Productivity
If parallel configuration interface is implemented, then configuration speed increases significantly, but device complexity increases
Solution Approach 1:
Multiple data paths and configuration channels are merged into a unified parallel interface architecture. The patent combines multiple independent data transfer paths, control signals, and configuration channels into an integrated parallel interface that operates cohesively, achieving high throughput while managing structural complexity through unified design principles.
Solution Approach 2:
The parallel configuration interface is designed with multi-functionality to handle various configuration tasks simultaneously. The same interface structure supports different data widths, multiple configuration regions, and various transfer modes, reducing the need for separate dedicated interfaces for each function and thereby managing overall device complexity.
3Loss of time
If high bandwidth interface is used for fast data transfer, then configuration time is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent uses standardized interface templates and repeated modular structures across multiple data paths. By copying proven interface designs and using identical routing patterns across parallel channels, the manufacturing process is simplified despite the increased number of interconnections, as each module can be fabricated using the same processes and verified against the same design rules.
4Speed
If existing interfaces are used for programmable logic devices, then device complexity is minimized, but they provide insufficient speed for complex tasks like machine learning and video processing
Solution Approach 1:
The parallel configuration interface implements dynamic resource allocation and adaptive data path selection. The interface can dynamically adjust the number of active data paths, data width, and transfer rates based on the configuration requirements, enabling optimal performance for different task complexities while managing architecture complexity through flexible rather than fixed structures.
Data Source
AI summary
An integrated circuit device may include programmable logic fabric disposed on a first integrated circuit die and having configuration memory. The integrated circuit device may also include a base die that may provide memory and/or operating supporting circuitry. The first die and the second die may be coupled using a high-speed parallel interface. The interface may employ microbumps. The first die and the second die may also include controllers for the interface.