Parallel Micro LED Chip Layout to Minimize Display Screen Defects
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Solution Overview
Problem
In light emitting diode (LED) display apparatuses, screen defects caused by defects in micro LED chips during packaging on thin film transistor array substrates lead to increased costs and technical challenges, as well as longer transfer times due to the need for redundancy modes.
Innovation Solution
A light emitting diode chip with first and second LEDs connected in parallel, each with common electrodes, is integrated into a display apparatus, allowing for redundancy-free operation by using one of the LEDs as a backup, thus minimizing defects and reducing transfer time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single micro LED chip is used in each pixel, then the device complexity is reduced, but screen defects occur due to chip defects during packaging
Solution Approach 1:
The LED chip is segmented into multiple independent LED units (first LED, second LED, third LED) within a single chip structure. Each LED unit has its own light emitting region and electrode connections, allowing individual operation. This segmentation enables redundancy where if one LED unit fails, others can compensate, thus reducing screen defects while maintaining relatively simple device structure.
Solution Approach 2:
The patent incorporates backup LED units (second LED, third LED) in advance within the same chip structure. These backup units are positioned and connected beforehand, ready to compensate if the primary LED unit fails during operation or packaging. This beforehand cushioning prevents screen defects without requiring complex post-packaging repair systems.
2Reliability
If redundancy mode is used to repair defects, then screen defect rate is reduced, but transfer time increases twice or more
Solution Approach 1:
Multiple LED units are merged into a single integrated chip structure with shared semiconductor substrate and common packaging. The first, second, and third LEDs are fabricated and connected on the same chip, allowing them to function as a unified component with built-in redundancy. This merging eliminates the need for separate transfer operations for backup chips, reducing transfer time while maintaining defect compensation capability.
Solution Approach 2:
The backup LED units are prepared and integrated into the chip structure during the initial manufacturing process. The redundant units are pre-positioned, pre-connected to electrodes, and pre-packaged within the same chip housing. This preliminary action ensures that when defects occur, the backup units are immediately available without requiring additional transfer or assembly operations, thus avoiding increased transfer time.
3Reliability
If multiple LED chips are transferred to ensure redundancy, then reliability is improved, but productivity decreases due to increased transfer time
Solution Approach 1:
Multiple functional LED units are merged into a single chip package, reducing the number of separate chip transfer operations required. Instead of transferring multiple separate chips to achieve redundancy, the patent combines multiple LED units within one chip, allowing a single transfer operation to provide both primary and backup lighting functions, thus maintaining productivity while ensuring reliability.
Solution Approach 2:
The single LED chip is designed with multi-functionality, serving both as the primary light source and as a backup system simultaneously. The first LED unit serves as the main operational unit, while the second and third LED units serve as backup units that can activate if needed. This universal design eliminates the need for separate backup chip transfers, maintaining production efficiency while providing defect compensation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes screen defects and reduces the LED display apparatus's production time and costs by eliminating the need for additional redundancy, enhancing productivity.
Implementation Method 1
first and second light emitting diodes provided on the semiconductor substrate in parallel with each other
Data Source
AI summary
A light emitting diode chip and a light emitting diode display apparatus comprising the same, are disclosed in which a screen defect caused by a defect of the light emitting diode chip is minimized. The light emitting diode chip comprises a semiconductor substrate; first and second light emitting diodes provided on the semiconductor substrate in parallel with each other while having first and second pads; a first electrode commonly connected to the first pad of each of the first and second light emitting diodes; and a second electrode commonly connected to the second pad of each of the first and second light emitting diodes, wherein the first and second light emitting diodes are electrically connected to each other in parallel.