Parallel Plating Liquid Activation for Substrate Processing Throughput
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Solution Overview
Problem
The semiconductor manufacturing process faces challenges in improving the throughput of substrate processing, particularly in plating processing, which is inefficient due to sequential processing steps that do not allow for parallel activation and utilization of plating liquids.
Innovation Solution
A substrate processing method and apparatus that activates plating liquid in parallel with forming a plating film and performing post-processing and drying, allowing for continuous processing by heating and maintaining the plating liquid at a preset temperature, and utilizing this activated liquid for subsequent substrates, thereby optimizing the sequence of operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If plating liquid activation is performed sequentially before substrate processing, then the plating liquid is properly activated, but the overall processing time increases and throughput decreases
Solution Approach 1:
The plating liquid is activated in advance during the plating film formation process of the previous substrate, so that when the next substrate is ready for processing, the plating liquid is already activated and ready for use. This eliminates the need for separate activation steps and enables continuous processing.
Solution Approach 2:
The activation process continues throughout the plating film formation process rather than being a separate discrete step. The plating liquid remains in the heating unit and continues to be heated and activated while the substrate is being processed, ensuring continuous readiness for the next substrate.
2Manufacturing precision
If multiple processing steps are performed sequentially, then each step can be completed thoroughly, but the total processing time increases
Solution Approach 1:
The activation process and plating film formation process are merged into a single continuous operation. The plating liquid is heated and activated in the heating unit while simultaneously forming the plating film on the substrate, combining two previously separate steps into one integrated process.
Solution Approach 2:
The plating liquid is pre-heated and activated during the plating film formation of the previous substrate, so that when the next substrate is introduced, the activation is already complete or in progress, eliminating waiting time between steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves the throughput of the substrate processing series by overlapping the activation, plating, and drying processes, reducing overall processing time and enhancing efficiency.
Implementation Method 1
a plating liquid is activated by previously heating and maintaining the plating liquid at a preset temperature
Implementation Method 2
the plating film is formed on the substrate by electroless plating while heating the substrate on which the plating liquid is accumulated
Data Source
AI summary
A substrate processing method includes activating, accumulating, forming a plating film, performing a post-processing and drying. In the activating, a plating liquid L1 is activated by heating and maintaining the plating liquid at a preset temperature. In the accumulating, the activated plating liquid is accumulated on a substrate W. In the forming of the plating film, the plating film is formed on the substrate by electroless plating while heating the substrate on which the plating liquid is accumulated. In the performing of the post-processing, the post-processing is performed on the substrate on which the plating film is formed. In the drying, the substrate after being subjected to the post-processing is dried. Activating the plating liquid for the substrate to be processed next is performed in parallel with the forming of the plating film, the performing of the post-processing, and the drying upon the substrate being processed currently.