Parallel Signal Routing Lines for Mismatched Die Contact Pitches
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Solution Overview
Problem
Conventional semiconductor device packaging processes face challenges in efficiently connecting semiconductor devices with different contact layouts, leading to increased cost and complexity due to the need for various intermediate structures, which are fabricated in advance and require complex design and inventory management.
Innovation Solution
A signal routing structure with a plurality of parallel conductive lines within a dielectric material layer, allowing for customizable electrical interconnections between semiconductor devices with different contact layouts, using straightforward processing techniques like masking, etching, and plating, and compatible with hybrid bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional packaging processes use intermediate structures to connect semiconductor devices with different contact layouts, then electrical connections can be achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent implements a universal bonding interface with a regular grid of bonding sites that can accommodate semiconductor devices with various contact layouts. The signal routing structure includes conductive lines arranged in a standardized pattern that can be configured through selective formation (e.g., using masks) to create different connection patterns, allowing a single interface design to serve multiple device types without requiring custom intermediate structures for each device layout.
Solution Approach 2:
The bonding interface is divided into discrete bonding sites arranged in a grid pattern, with signal routing structures that can be selectively formed between these sites. This segmentation allows the system to accommodate different contact layouts by selectively activating or deactivating specific routing paths, rather than requiring completely different intermediate structures for each device type.
2Ease of manufacture
If intermediate structures are fabricated in advance for packaging, then electrical connections can be established, but manufacturing cost and inventory management complexity increase
Solution Approach 1:
The signal routing structure is designed to be dynamically configurable during the packaging process itself. Rather than requiring pre-fabricated intermediate structures with fixed connection patterns, the patent allows the routing patterns to be adapted on-demand through selective formation processes (such as selective plating or mask-based patterning) that can be performed as part of the standard packaging workflow, eliminating the need for separate pre-fabrication and inventory management steps.
Solution Approach 2:
The bonding interface structure is prepared in advance with a regular grid of bonding sites and basic dielectric layers, but the specific signal routing patterns are formed later during the packaging process based on the actual device requirements. This approach combines the benefits of pre-prepared infrastructure with on-demand customization, avoiding the need to fabricate complete intermediate structures in advance.
3Reliability
If conventional packaging encapsulates dies to protect them, then environmental protection is achieved, but assembly height and processing complexity increase
Solution Approach 1:
The patent employs thin dielectric film layers to provide environmental protection for the bonding interface and semiconductor devices. Instead of thick encapsulant materials, the design uses multiple thin dielectric layers (such as spin-on-glass or other conformal dielectric films) that provide adequate protection while minimizing vertical space requirements, thus reducing overall assembly height.
Solution Approach 2:
The bonding interface structure integrates the signal routing conductors within the dielectric layers rather than placing them externally. The conductive lines are embedded within or between dielectric layers, creating a nested configuration that provides protection while maintaining a compact vertical profile, eliminating the need for separate external encapsulation layers.
Data Source
AI summary
A semiconductor device assembly includes a first semiconductor device having a first plurality of electrical contacts with a first average pitch, a second semiconductor device over the first semiconductor device and having a second plurality of electrical contacts with a second average pitch, and a signal routing structure between the first and second semiconductor devices and including a first plurality of conductive structures, each in contact with one of the first plurality of electrical contacts, a second plurality of conductive structures, each in contact with one of the second plurality of electrical contacts, and a pattern of parallel conductive lines between the first and second pluralities of conductive structures. The pattern of parallel conductive lines has a third average pitch less than the first and second average pitches, and pairs of conductive structures from the first and second pluralities are electrically coupled by different ones of the parallel conductive lines.