Parallel Source Conductor Layout for Low-Inductance Power Semiconductors

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Solution Overview

Problem

Conventional semiconductor devices with power semiconductor elements connected in parallel face challenges in reducing inductance between switching elements, which can lead to resonance phenomena, affecting their operational efficiency.

Innovation Solution

The semiconductor device incorporates parallel connection paths between the source electrodes of multiple semiconductor elements, utilizing conductive paths that are at least partially in parallel, reducing the combined inductance and preventing resonance by shortening the conduction paths through specific conductor configurations and connection members.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If power semiconductor elements are connected in parallel to ensure allowable electric power, then the power handling capability is improved, but the inductance between switching elements increases causing resonance phenomena

Engineering Contradiction:
Improveallowable electric powerVSAvoidoperational efficiency
Core Design Contradiction:
PowerVSReliability

Solution Approach 1:

The patent segments the connection paths between source electrodes into multiple separate conductive paths. Instead of using a single common connection structure, each semiconductor element is connected through its own dedicated conductor to the common electrode, dividing the current path into parallel segments that reduce mutual inductance effects.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from planar connection structures to three-dimensional routing of conductors. The conductors are arranged in different spatial layers and positions above the semiconductor elements, creating vertical and lateral separation between current paths. This dimensional separation reduces the magnetic coupling between adjacent conductors, thereby reducing inductance and preventing resonance phenomena.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Device complexity

If conventional connection structures are used between source electrodes, then the device structure is simple, but the inductance is high leading to resonance phenomena

Engineering Contradiction:
Improveconnection structureVSAvoidresonance suppression
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent applies different structural characteristics to different parts of the connection system. The conductors have varying heights, widths, and positions optimized for their specific locations. Each conductor is locally adapted to minimize inductance in its particular region while maintaining overall structural integrity, rather than using a uniform connection structure throughout.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent implements a nested arrangement where conductors are positioned at different heights above the semiconductor elements, with some conductors located vertically above others. This nested, multi-level configuration allows current paths to be closely spaced where needed while maintaining spatial separation to reduce inductance, creating a compact yet effective connection structure.

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces inductance between the source electrodes, thereby suppressing resonance phenomena and enhancing the operational efficiency of semiconductor devices when multiple elements are operated in parallel.

Implementation Method 1

first and second conductors, each electrically interposed between two second electrodes (112) (source electrodes) of two first semiconductor elements (11) adjacent in a first direction (x)

Methodology Applied
Scientific EffectElectrical Conduction: Conduction (electrical)

Data Source

PatentUS20240030112A1Semiconductor device
Publication Date: 2024.01.25 ROHM CO LTD
  • US20240030112A1 patent drawing
  • US20240030112A1 patent drawing
  • US20240030112A1 patent drawing

AI summary

A semiconductor device includes two semiconductor elements for switching, a first conductor electrically connecting the second electrodes of the two semiconductor elements, a second conductor electrically connecting the second electrodes, and a first power terminal electrically connected to the first conductor and the second electrodes of the first semiconductor elements. The two first semiconductor element are connected in parallel with each other. A first conduction path and a second conduction path are provided between the second electrodes of the two semiconductor elements and extend through the first conductor and the second conductor, respectively. The first conduction path and the second conduction path are at least partially in parallel. The combined inductance of the first conduction path and the second conduction path is smaller than the inductance of the first conduction path.