Parallel Substrate Inspection Apparatus for Semiconductor Wafers
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Solution Overview
Problem
Current single inspection apparatuses for substrates, such as semiconductor wafers, have limited throughput in inspecting substrates before or after treatments like resist coating and developing, as they are primarily designed for inspection without integrated treatment capabilities.
Innovation Solution
The inspection apparatus features two stages with non-overlapping positions for housing containers and imaging units, along with parallel transfer regions for the wafer transfer mechanisms, allowing simultaneous inspection and transfer operations to improve throughput by enabling parallel processing of substrates between different inspection parts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single inspection apparatus is used for substrate inspection, then the device complexity is reduced, but the inspection throughput is limited
Solution Approach 1:
The inspection apparatus is divided into two independent inspection parts (first inspection part and second inspection part), each capable of inspecting substrates independently. This segmentation allows parallel inspection operations to increase throughput while keeping each inspection unit relatively simple in structure.
Solution Approach 2:
The two inspection parts are arranged in different spatial positions (first inspection part at first position, second inspection part at second position) rather than stacking them vertically or horizontally in a single line. This spatial arrangement enables parallel operations while maintaining manageable device complexity.
2Productivity
If multiple inspection parts are provided in parallel, then the inspection throughput is improved, but the apparatus footprint increases
Solution Approach 1:
The transfer mechanisms for both inspection parts share a common transfer region and overlapping operational space. By merging the transfer functions and allowing the transfer mechanisms to operate in overlapping regions, the apparatus footprint is reduced while maintaining parallel inspection capabilities.
Solution Approach 2:
The transfer mechanisms are designed to operate in three-dimensional space with overlapping projections in plan view. This allows the transfer regions to share horizontal space while operating at different vertical levels or with coordinated motion paths, reducing the overall apparatus footprint.
3Area of stationary object
If transfer regions overlap in plan view, then the apparatus footprint is reduced, but the transfer mechanism control complexity increases
Solution Approach 1:
The transfer mechanisms are designed with dynamic control capabilities, allowing their operational paths and timing to be adjusted based on real-time conditions. This dynamic control enables coordinated operation in overlapping regions, managing the complexity through adaptive scheduling and motion control rather than rigid fixed paths.
Solution Approach 2:
The control system incorporates feedback mechanisms to monitor and coordinate the operations of both transfer mechanisms in the overlapping transfer region. This feedback control ensures that the transfer operations are synchronized and conflict-free, managing the complexity through real-time coordination rather than pre-programmed fixed sequences.
Data Source
AI summary
An inspection apparatus includes: first and second stage parts on which a housing container housing substrates is mounted; first and second inspection parts having an imaging unit imaging the substrate; a first transfer region provided with a first transfer mechanism performing a first operation of transferring the substrate between the first stage part and the first inspection part; and a second transfer region provided with a second transfer mechanism performing a second operation of transferring the substrate between the second stage part and the second inspection part. In plan view, the first and second stage part are at positions not overlapping with each other, the first and second inspection part are at positions not overlapping with each other, and the first and second transfer region are at positions different from each other so as to perform the first and second operation in parallel.