Optically Investigating Flaws/Contamination TRIZ Cases

Spatial registration aligns anomaly data from multiple web manufacturing operations to resolve detection difficulties across complex production lines.

A camera positioning jig aligns the lens holding cylinder with the inspection hole centerline for precise optical setup.

Reflectometry detects coating discontinuities to maintain vacuum integrity and prevent material leaching in evacuated blood collection tubes.

Linear inset LED transillumination and cylindrical lens focus light through float glass strips for precise thickness and refractive power measurement.

Optical inspection device detects container rotation through light energy fluctuations captured by a sensor.

A graphical user interface displays a 3D equipment model and emphasizes components linked to selected functions.

Fluorescence triggering screens white blood cells from unlysed red blood cell fragments, enabling accurate differential analysis without strong lysis reagents.

A surface acquisition system uses an LED to project a fine light beam with a fringe thickness of less than 50 μm for precise profiling.

Dual illumination sources provide diffuse and direct light to a line sensor, enabling accurate measurement of reflecting properties on metallic surfaces.

A two dimensional detector subdivides photosensitive areas into stripes using independent linear shift register arrays for parallel readout.

A time delay and integration sensor reduces its collection area width to reject stray deep ultraviolet light.

A compact optical measuring system uses a single detector and beam splitter to analyze small-volume bulk materials.

Automated optical imaging replaces manual calipers to measure tube geometry, reducing inspection time from days to under an hour while eliminating human error.

A single camera captures top and side container views using a reflector, eliminating multiple cameras to reduce system complexity.

Edge-directed infrared light scatters at substrate cracks, avoiding mechanical stress and background noise for accurate defect identification.

Optimize photoluminescence parameters to identify bar-shaped stacking faults in high-impurity SiC substrates, preventing bipolar degradation.

A device uses an opaque diffuser with internal light sources to provide uniform illumination for optical shape measurement.

Segmented transport reduces inspection time while maintaining thorough defect detection across all reticle pod surfaces.

Transparent resin and mirrors redirect light through the air pipe joint, eliminating blind spots caused by opaque joints obstructing illumination.

Comparing reference and control inspections detects measurement drift in defect sizes, maintaining system stability without frequent cleaning.

A dual lens inspection device employs a beam splitter to share optical paths between low and high power lens groups.

A fluorescence inspection system adapts excitation intensity to enhance weak luminescence signals from test object surfaces.

A pulse multiplier uses a ring cavity to split and recirculate laser pulses, increasing repetition rate while maintaining peak power.

A near-eye display evaluation system captures high-resolution sub-images across segmented view fields and synthesizes them into a complete full image.

A foreign matter inspection device combines X-ray and infrared application units with a selective protection shield.

Gradient illumination detects refractive defects on scrolling containers, eliminating mechanical rotation and manufacturing disruption.

Raw scatterometry signal models compute overlay errors directly, resolving accuracy losses from coupling with unrelated structural asymmetries.

A nanocrystal-based illumination system generates broadband light via photoluminescence.

Flattening the beam profile raises detection sensitivity by maintaining higher power levels while preventing thermal damage to the semiconductor substrate.

Integrating optical inspection with aligner rotation detects wafer defects without adding processing time or increasing system complexity.

Inclined bottom rails guide covers by gravity to detection and removal areas, eliminating horizontal conveyor power needs.

Variable rotation speed extends irradiation time at the wafer periphery, resolving the trade-off between inspection productivity and detection sensitivity.

A Faraday rotator positioned between a polarizing beam splitter and target minimizes light intensity degradation during semiconductor mask inspection.

Automated program generation extracts target positions from workpiece drawings to control movement and imaging mechanisms.

A movable inspection device uses an inclined elliptical mirror to capture shadowed areas behind vessel flanges, resolving detection precision limits.

A dual-resolution optical device detects transparent substrate flaws using inclined low-resolution scanning and targeted high-resolution imaging.

A box-like inspection body uses opaque pigmentation to minimize internal light reflection for high-resolution video capture.

A carousel employs a movable sensor to scan labels, reducing device complexity and space requirements.

A controller corrects phase fluctuations in a Pockels cell using intensity modulation characteristics to stabilize laser power.

Stored intensity and color values resolve dark-field color errors during wafer surface inspection.

A defect inspection device generates a delay signal to synchronize detection with pulsed laser irradiation.

Asymmetric illumination angles eliminate laser line obscuration on reflective surfaces, enabling high-speed defect detection.

A collimator with non-parallel optical axes directs light from an anisotropic source into a measuring region for elongate textile bodies.

Fuses transmission and infrared images to classify defects in hot glass containers, resolving ambiguity that causes incorrect identification.

Optical imaging extracts geometric and colorimetric features from berry images to determine volume and composition.

Symmetrical illumination around the detection unit reduces patient motion noise, enhancing signal-to-noise ratio for accurate blood volume pulse monitoring.

A camera and laser ranging device capture 2D images and distance measurements to calculate precise 3D coordinates of damaged regions.

A beam of light induces fluorescence emission from low-k dielectric materials to amplify defect signals during semiconductor workpiece inspection.

Movable gripper rows create optical access paths, enabling reliable container type identification despite dirt deposits and mixed crate arrangements.

A parallel substrate inspection apparatus uses independent transfer mechanisms to move wafers simultaneously between stages and imaging units.