Sensor Module With Parallel Surfaces for Angular-Velocity Sensing
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Solution Overview
Problem
Existing sensor devices face challenges in juxtaposing multiple angular velocity sensor devices in parallel due to their mounting on side surfaces of a plate-shaped circuit board, which complicates the arrangement and affects detection accuracy.
Innovation Solution
A sensor module design featuring a base with parallel placement surfaces for inertial sensor devices, allowing them to be arranged in a row along a normal direction, facilitated by a flexible wiring board for easier attachment and alignment of detection axes, enhancing detection accuracy and enabling downsizing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If X-axis angular velocity sensor devices are mounted on side surfaces of the plate-shaped circuit board, then the sensor devices can be mounted on the circuit board, but it becomes difficult to juxtapose multiple sensor devices in parallel to one another
Solution Approach 1:
The patent transitions from mounting sensors on the side surfaces of a plate-shaped circuit board to mounting them on a three-dimensional base structure with multiple parallel placement surfaces. This dimensional change allows multiple sensors to be arranged in parallel across different surfaces while maintaining their functional orientation, thereby simplifying the arrangement process and improving manufacturability.
2Measurement precision
If multiple angular velocity sensor devices are arranged in parallel, then detection accuracy is improved through noise reduction, but the arrangement becomes difficult when mounted on side surfaces of a plate-shaped circuit board
Solution Approach 1:
By moving from a two-dimensional plate-shaped circuit board to a three-dimensional base with multiple parallel placement surfaces, the patent enables easy parallel arrangement of sensor devices. The base structure provides dedicated surfaces for each sensor, allowing them to be positioned in parallel orientations while maintaining alignment, thus improving both measurement precision and ease of operation.
Solution Approach 2:
The base structure serves as an intermediary component that facilitates the parallel arrangement of sensor devices. It provides a unified mounting platform with multiple parallel placement surfaces, enabling precise alignment and positioning of multiple angular velocity sensors without requiring complex arrangement procedures on a plate-shaped circuit board.
3Productivity
If sensor devices are mounted on side surfaces of a plate-shaped circuit board, then they can be integrated into the system, but the module size cannot be reduced
Solution Approach 1:
The patent employs a nested structure where multiple sensor devices are arranged in parallel on the three-dimensional base, allowing compact integration. The base structure accommodates multiple sensors within a unified volume, enabling the sensor module to be downsized while maintaining full functionality and integration of all sensor devices.
Data Source
AI summary
A sensor module includes a first inertial sensor device group including a first inertial sensor device, a second inertial sensor device, and a third inertial sensor device, and a base including a first placement surface on which the first inertial sensor device is disposed, a second placement surface parallel to the first placement surface, on which the second inertial sensor device is disposed, and a third placement surface parallel to the first placement surface, on which the third inertial sensor device is disposed.