Parallelogram Optoelectronic Chip Radiation Surface Design

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Solution Overview

Problem

Conventional optoelectronic semiconductor chips and components face challenges in maximizing the size of the radiation exit surface while maintaining efficient electrical connections, leading to increased production costs and reduced luminous image homogeneity.

Innovation Solution

The design of an optoelectronic semiconductor chip with a non-rectangular, parallelogram-shaped top surface and a radiation exit surface, where the connection areas are arranged in a triangular fashion, allowing for a larger radiation exit surface area relative to the connection area, and the use of a rectangular conversion element that covers the radiation exit surface without cutouts for conventional components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of moving object

If a conventional rectangular optoelectronic semiconductor chip design is used, then the connection area can be easily arranged, but the radiation exit surface area is limited and production costs increase

Engineering Contradiction:

Improveradiation exit surface areaVSAvoidproduction cost

Core Design Contradiction:

Area of moving objectVSEase of manufacture

Solution Approach 1:

The patent applies asymmetry by changing the chip top surface from a conventional rectangular shape to a parallelogram shape. This asymmetric geometric transformation allows the radiation exit surface to be enlarged while the connection areas are repositioned to the corner regions, optimizing the ratio between radiation exit area and connection area without increasing production complexity

Inventive Principle:

Principle #4Asymmetry

Solution Approach 2:

The patent utilizes dimensional rearrangement by redistributing the connection areas from central positions to corner positions on the parallelogram-shaped top surface. This spatial reconfiguration in two dimensions enables the radiation exit surface to occupy the majority of the chip area while maintaining accessible electrical connection points at the corners

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Area of moving object

If the radiation exit surface is enlarged in conventional designs, then more light can exit, but the connection area becomes relatively larger and production becomes more costly

Engineering Contradiction:

Improveradiation exit surface areaVSAvoidconnection area

Core Design Contradiction:

Area of moving objectVSQuantity of substance

Solution Approach 1:

The parallelogram geometry creates an asymmetric layout where connection areas are pushed to the corners, allowing the central and edge regions to be dominated by the radiation exit surface. This asymmetric arrangement minimizes the relative area occupied by connection structures while maximizing the radiation exit area

Inventive Principle:

Principle #4Asymmetry

Solution Approach 2:

The top surface is segmented into distinct functional zones: corner regions for electrical connections and central/edge regions for radiation exit. This spatial segmentation allows independent optimization of each zone, enabling large radiation exit area while keeping connection area minimal

Inventive Principle:

Principle #1Segmentation

3Manufacturing precision

If conventional rectangular chips are used, then production is simpler, but the luminous image homogeneity is reduced

Engineering Contradiction:

Improveluminous image homogeneityVSAvoidproduction complexity

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The parallelogram shape with specific angular relationships creates more uniform light distribution across the radiation exit surface. The asymmetric geometry allows optimized positioning of the active zone relative to the exit surface, improving luminous image homogeneity while maintaining compatibility with standard semiconductor manufacturing processes

Inventive Principle:

Principle #4Asymmetry

Solution Approach 2:

The patent changes the geometric parameters of the chip top surface from rectangular to parallelogram with specific angle and side length ratios. These parameter optimizations enhance the uniformity of light emission across the radiation exit surface while the tolerances are set to remain compatible with conventional production capabilities

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables a larger radiation exit surface area with a smaller connection area, reducing production costs and enhancing luminous image homogeneity, while allowing for efficient electrical connections and efficient use in applications requiring non-square radiation exit surfaces.

Implementation Method 1

The active zone is provided for generating electromagnetic radiation, for example, light, during the operation of the optoelectronic semiconductor chip

Methodology Applied

Scientific EffectElectroluminescence: Electroluminescence

Data Source

PatentUS9793447B2Optoelectronic semiconductor chip and optoelectronic semiconductor component

Publication Date: 2017.10.17 OSRAM OLED

AI summary

An optoelectronic semiconductor chip has a non-rectangular, parallelogram-shaped top surface and an active zone, which is at a distance from the top surface and runs parallel to the top surface at least in places. The top surface includes a radiation exit surface, through which electromagnetic radiation generated during operation in the active zone emerges. The radiation exit surface has at least four vertices. The top surface includes at least one triangular connection area via which the active zone is electrically connectable.