Parking Structure Memory Tester Vertical Stacking

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Solution Overview

Problem

Robotic test systems for memory modules are limited by the number of motherboards that can be reached by a robotic arm, leading to increased testing costs due to the high cost of the robotic arm and reduced testing throughput.

Innovation Solution

Implementing a conveyor and elevator system to move motherboards away from the robotic arm to a parking and testing structure, allowing multiple motherboards to be tested simultaneously, with testing performed at a location away from the robotic handler, and then returning them for unloading and reloading.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a robotic arm is used to service motherboards for memory module testing, then automated testing can be performed, but the number of motherboards that can be tested simultaneously is limited by the reach of the robotic arm

Engineering Contradiction:
Improvetesting throughputVSAvoidsystem complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The system transitions from a two-dimensional planar workspace to a three-dimensional vertical workspace by implementing multi-level stacking of motherboards. Motherboards are arranged in vertical stacks with multiple levels, allowing the robotic arm to service many more motherboards within the same floor space. The robotic arm uses a vertical motion component to access different levels, dramatically increasing the number of motherboards that can be tested simultaneously without increasing the robotic arm's reach in the horizontal plane.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If more motherboards are placed within reach of the robotic arm to increase testing capacity, then testing throughput increases, but the cost of the robotic arm system increases

Engineering Contradiction:
Improvetesting throughputVSAvoidsystem cost
Core Design Contradiction:
ProductivityVSEase of manufacture

Solution Approach 1:

By utilizing vertical space through multi-level stacking, the system increases testing capacity without requiring a more expensive, larger-reach robotic arm. The same robotic arm can service motherboards across multiple vertical levels, effectively multiplying the number of motherboards serviced without increasing the robotic arm's specifications or cost.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The system implements dynamic reconfiguration of the motherboard testing arrangement. Motherboards can be dynamically loaded and unloaded from different levels of the stack, and the robotic arm can dynamically adjust its path to service different levels. This dynamic approach allows flexible optimization of testing throughput without requiring additional expensive hardware.

Inventive Principle:
Principle #15Dynamics

3Productivity

If the robotic arm services more motherboards simultaneously, then testing efficiency improves, but the complexity of managing multiple motherboards increases

Engineering Contradiction:
Improvetesting efficiencyVSAvoidmanagement complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The robotic arm is designed with multi-functionality to handle multiple types of operations across different motherboard levels. A single robotic arm performs loading, unloading, and positioning of motherboards across multiple vertical levels, eliminating the need for separate robotic systems for each level. This universal approach simplifies management compared to using multiple specialized robotic arms.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS8581614B2Parking structure memory-module tester that moves test motherboards along a highway for remote loading/unloading
Publication Date: 2013.11.12 KINGSTON TECHNOLOGY CORP
  • US8581614B2 patent drawing
  • US8581614B2 patent drawing
  • US8581614B2 patent drawing

AI summary

A parking-structure test system has motherboards that test memory modules. The motherboards are not stationary but are placed inside movable trays that move along conveyors. An unloader removes tested memory modules from test sockets on the motherboards, and a loader inserts untested memory modules into the motherboards using a robotic arm. A conveyor carries the motherboards from the loader to a parking and testing structure. An elevator raises or lowers the motherboards to different parking levels in the parking and testing structure. The motherboards move from the elevator to test stations on the parking level. A retractable connector from the test station makes contact with a motherboard connector to power up the motherboard, which then tests the memory modules. Test results are communicated from the test station to a host controller, which instructs the loader-unloader to sort the tested memory modules once the motherboard returns via the elevator and conveyors.