Dual Particle Beam Drift Correction via Reference Markings
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Solution Overview
Problem
Particle beam systems with two columns face challenges in precision and reproducibility due to mechanical drifts and temperature changes, affecting the accuracy of structured objects, especially during prolonged processes like TEM lamella production.
Innovation Solution
A method involving one particle beam column for producing a target structure and repeatedly creating markings, while the second beam column captures these markings to correct for drifts, ensuring precise positioning and beam deflections, even with differing angles and mechanical shifts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a particle beam system with two columns is used for structuring objects, then the process can be monitored and material can be deposited or removed, but mechanical drifts and temperature changes cause precision loss over time
Solution Approach 1:
The patent applies preliminary action by producing reference markings on the substrate before and during the structuring process. These markings serve as reference points that capture the position of the particle beam column at different times. By establishing these reference markings in advance and during processing, the system can later compare positions to detect and correct drifts, thereby maintaining precision over extended process durations.
Solution Approach 2:
The patent implements feedback by continuously monitoring the position of the particle beam column using reference markings captured by a second particle beam column. The system compares the current position with reference positions stored from earlier markings, detects any drift, and applies corrective beam deflections to maintain accurate positioning. This closed-loop feedback mechanism ensures precision is maintained throughout the prolonged structuring process.
2Measurement precision
If the particle beam process is monitored by a second particle beam column, then process visibility is improved, but mechanical drift between columns and angular differences limit measurement precision
Solution Approach 1:
The patent uses reference markings as an intermediary between the two particle beam columns. Instead of directly measuring the position of the structuring beam with the monitoring beam (which suffers from mechanical drift and angular differences), the system uses stable reference markings on the substrate as a common reference frame. Both beams reference their positions to these markings, eliminating the problem of relative mechanical drift between columns and improving measurement reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances precision and minimizes the impact of drifts, allowing for accurate and reproducible structure production with reduced errors, especially in three-dimensional structures with varying surface normals.
Implementation Method 1
a first particle beam generated by a first particle beam column is directed at a multiplicity of sites of the substrate to deposit material thereon or to remove material therefrom
Implementation Method 2
capturing positions of markings on the substrate by directing a second particle beam produced by a second particle beam column onto the markings on the substrate, and detecting particles or radiation which are produced in the process
Data Source
AI summary
A includes arranging a substrate in a working region of a first particle beam column and a second particle beam column; producing a desired target structure on the substrate by directing a first particle beam generated by the first particle beam column at a multiplicity of sites of the substrate to deposit material thereon or to remove material therefrom; repeatedly interrupting the production of the desired target structure and producing a marking on the substrate by directing the first particle beam onto the substrate and continuing the production of the desired target structure; and capturing positions of the markings on the substrate by directing a second particle beam produced by the second particle beam column onto the markings on the substrate, and detecting particles or radiation which are produced in the process by the second particle beam on the substrate.