Focused Particle Beam Reference Mark Removal
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Solution Overview
Problem
As feature sizes on substrates, such as photolithographic masks and micro-electromechanical systems, shrink to the dimensions comparable with reference marks used for drift correction, these marks can interfere with processing and affect image quality, leading to exposure losses and stability issues under ultraviolet radiation.
Innovation Solution
A method is introduced to generate and remove reference marks using focused particle beams and specific precursor gases, allowing for precise drift correction and subsequent removal of the marks using conventional processes, ensuring minimal impact on substrate processing and image quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If reference marks are used for drift correction during particle beam processing, then positioning accuracy is improved, but image quality deteriorates due to interference with processing and exposure losses
Solution Approach 1:
The reference mark is temporarily introduced for drift correction and then completely removed after processing. This extraction principle eliminates the harmful presence of the reference mark in the final product while utilizing it during the processing phase for accurate positioning.
Solution Approach 2:
The reference mark is generated before the actual processing to enable drift correction during processing. By performing this preliminary action, the system establishes a reference framework that improves positioning accuracy without requiring the reference mark to persist in the final product.
2Stability of the object's composition
If reference marks are used for drift correction, then positioning stability is improved, but long-term stability deteriorates under ultraviolet radiation
Solution Approach 1:
The reference mark is extracted from the system after serving its purpose for drift correction. This eliminates the reference mark before it can undergo degradation from ultraviolet radiation exposure, thereby maintaining long-term stability of the processed substrate.
Solution Approach 2:
The reference mark is treated as a temporary, disposable element used only during processing. It is generated, used for drift correction, and then removed, avoiding the need for long-term durability under radiation that would be required if the reference mark were to remain in the final product.
3Device complexity
If conventional removal processes are used for reference marks, then manufacturing complexity is reduced, but processing time increases
Solution Approach 1:
The reference mark is designed to be removable by conventional processes that are already part of the standard manufacturing workflow. This self-service approach allows the reference mark removal to be integrated into existing process steps without requiring additional specialized equipment or procedures.
Solution Approach 2:
The reference mark removal step is combined with existing conventional processing steps in the manufacturing workflow. By merging this function into already-planned process steps, the system avoids adding separate dedicated removal operations, thereby minimizing additional processing time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables accurate drift correction and removal of reference marks, maintaining image quality and long-term stability, even under deep ultraviolet radiation, without requiring expensive modifications to existing particle beam apparatuses.
Implementation Method 1
generating at least one reference mark (410, 420) on the substrate (105) with a known composition using the focussed particle beam (127) and at least one first precursor gas
Implementation Method 2
processing the substrate (105) with the focussed particle beam (127)
Data Source
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AI summary
The invention relates to a method for processing a substrate with a focussed particle beam which incidents on the substrate, the method comprising the steps of: (a) generating at least one reference mark on the substrate using the focused particle beam and at least one processing gas, (b) determining a reference position of the at least one reference mark, (c) processing the substrate using the reference position of the reference mark, and (d) removing the at least one reference mark from the substrate.