Partitioned Refrigerant Cooling for Semiconductor Devices
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Solution Overview
Problem
In semiconductor devices, the refrigerant flow path design leads to uneven refrigerant temperatures between upstream and downstream semiconductor elements during inverter operation, limiting current-carrying ability and reducing reliability due to heat absorption disparities.
Innovation Solution
A semiconductor device design featuring a partition with strategically located inflow openings corresponding to semiconductor elements, allowing concentrated refrigerant flow through cooling fins, which reduces temperature differences by increasing refrigerant flow rates and optimizing the flow path within the jacket.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a uniform refrigerant inflow-side gap is used in the partition, then the refrigerant flows uniformly through the cooling fins, but the refrigerant temperature increases significantly by the time it reaches downstream semiconductor elements, limiting cooling effectiveness
Solution Approach 1:
The partition structure implements local quality by providing different gap configurations at different locations. The refrigerant inflow-side gap is positioned to correspond with semiconductor elements requiring cooling, creating localized high-flow regions. This non-uniform gap distribution ensures that refrigerant flow is concentrated where needed rather than uniformly dispersed, maintaining lower refrigerant temperatures at downstream locations by reducing heat absorption in upstream regions.
2Reliability
If the refrigerant flows through all cooling fins uniformly, then all semiconductor elements receive cooling, but the refrigerant absorbs too much heat from upstream elements to effectively cool downstream elements
Solution Approach 1:
The invention changes the flow path parameters by positioning the refrigerant inflow-side gap to correspond with semiconductor elements. This parameter modification alters the refrigerant flow distribution, creating a flow pattern that reduces excessive heat absorption in upstream regions. The gap positioning parameter is specifically adjusted to optimize the balance between cooling coverage and maintaining sufficient cooling capacity for downstream elements.
3Device complexity
If the partition is disposed horizontally relative to the cooling fins, then the refrigerant flow path is simplified, but the refrigerant temperature difference between upstream and downstream becomes excessive
Solution Approach 1:
The invention transitions from a horizontal partition configuration to a vertical arrangement where the refrigerant inflow-side gap corresponds with semiconductor elements in the vertical flow direction. This dimensional change in gap positioning allows the refrigerant to be supplied more effectively to cooling fins associated with downstream elements, reducing temperature differences without significantly increasing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses refrigerant temperature increases, ensuring uniform cooling across the semiconductor elements, thereby enhancing the semiconductor device's reliability and durability.
Implementation Method 1
a direct-cooled cooling structure in which cooling fins are disposed on a lower surface of a base plate on which semiconductor elements are mounted
Implementation Method 2
a refrigerant having flowed in through a refrigerant inlet flows into the cooling fins through a refrigerant inflow-side gap
Data Source
AI summary
It is an object to reduce a difference in temperature of a refrigerant between an upstream side and a downstream side of a flow path even in a case where all semiconductor elements generate heat due to inverter operation and the like. A semiconductor device includes at least one semiconductor element, a base plate, a plurality of cooling fins, a jacket, and a partition. The partition is disposed below the plurality of cooling fins in the jacket. The partition has at least one inflow opening to allow the refrigerant having flowed in through the refrigerant inlet to flow through the plurality of cooling fins, and has a portion abutting the jacket on the side of the refrigerant inlet. The at least one inflow opening is located to correspond to the at least one semiconductor element.