Passive Chip Device Single-Piece Body Coil Terminal Contacts
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Solution Overview
Problem
Conventional methods for manufacturing passive chip devices, such as multilayered and thin film inductors, are complex and prone to issues like non-ohmic contacts and Joule-heating due to numerous steps involved in forming terminal contacts.
Innovation Solution
A passive chip device with a single-piece chip body and a surface-mount contact unit, where a conductive coil or capacitor is formed on the chip body, and terminal contacts extend from the end faces to the surface, simplifying the manufacturing process and enhancing mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional multilayered type inductor manufacturing method is used, then terminal contacts can be formed, but the process complexity increases and non-ohmic contact issues occur
Solution Approach 1:
The patent merges the terminal contact formation with the chip body structure by forming the terminal contacts as integral parts of the chip body during the same sintering process, eliminating the need for separate terminal contact formation steps and reducing overall process complexity while ensuring reliable ohmic contacts
2Reliability
If numerous manufacturing steps are used to form terminal contacts, then terminal contacts can be created, but Joule-heating issues arise at interfaces
Solution Approach 1:
The terminal contacts are formed as integral parts of the chip body through concurrent sintering, creating seamless interfaces without additional bonding interfaces that would generate Joule-heating, thereby reducing energy loss while maintaining contact reliability
3Strength
If chip body is formed as single piece, then mechanical strength increases, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the chip body into multiple green chips arranged in a matrix pattern on the tape, allowing each green chip to be formed with standard precision, then joins them through co-sintering to achieve the final single-piece structure with high mechanical strength, effectively distributing and managing precision requirements
Data Source
AI summary
A passive chip device includes a chip body, a conductive coil and a surface-mount contact unit. The chip body is in the form of a single piece, and has two opposite end faces and a first surface which is between the end faces. The conductive coil is deposited on and surrounding the chip body. The surface-mount contact unit includes two spaced apart conductive terminal contacts. Each of the terminal contacts extends from a respective one of the end faces to the first surface and connects to a respective one of end portions of the coil. The method of making the passive chip device is also disclosed.