Passive Device Assembly on RDL Stack for Integrated Packages
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Solution Overview
Problem
The incorporation of passive electronic components in electronic systems often occupies valuable board space and introduces electrical losses due to their lateral mounting arrangement, which increases signal pathway lengths and noise.
Innovation Solution
The integration of passive electronic devices onto a redistribution layer (RDL) stack disposed over an integrated device die reduces the overall footprint and minimizes electrical losses by positioning passive devices closer to active circuitry, utilizing an insulating and conductive RDL stack for efficient signal communication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If passive electronic components are mounted laterally adjacent to the integrated device die on the package substrate, then the components can be electrically connected to the die, but the package footprint increases and signal pathway length increases causing electrical losses
Solution Approach 1:
The patent transitions from lateral mounting of passive components on the package substrate to vertical mounting on the RDL stack above the integrated device die. This dimensional change from horizontal to vertical arrangement reduces the package footprint while maintaining electrical connectivity through the RDL interconnect structure.
Solution Approach 2:
The passive electronic components are mounted on the RDL stack which is disposed over the integrated device die, creating a nested vertical arrangement. The RDL stack acts as an intermediate platform that nests the passive components closer to the active die, reducing signal pathway length and package area.
2Ease of manufacture
If passive electronic components are mounted laterally adjacent to the integrated device die, then the components can be electrically connected to the die, but the signal pathway length increases causing electrical losses and noise
Solution Approach 1:
By mounting passive components vertically on the RDL stack above the die rather than laterally on the substrate, the signal pathway length is reduced. The RDL provides short vertical interconnect paths between the passive components and the active circuitry, minimizing electrical losses and noise.
Solution Approach 2:
The RDL stack provides localized electrical interconnection directly above the integrated device die, creating short signal pathways specifically where needed. This local interconnection quality reduces electrical losses compared to long lateral pathways on the package substrate.
3Ease of manufacture
If passive electronic components are mounted laterally adjacent to the integrated device die, then the components can be electrically connected to the die, but the package footprint increases occupying valuable board space
Solution Approach 1:
The patent utilizes the vertical dimension by mounting passive components on the RDL stack above the integrated device die. This vertical integration reduces the horizontal board space required, as components are stacked rather than spread out laterally on the package substrate.
Solution Approach 2:
The nested vertical arrangement of the RDL stack over the integrated device die with passive components mounted on the RDL creates a compact structure. This nesting reduces the overall package footprint and valuable board space occupation while maintaining all necessary electrical connections.
Data Source
AI summary
An integrated device package is disclosed. The package can include a package substrate and an integrated device die having active electronic circuitry. The integrated device die can have a first side and a second side opposite the first side. The first side can have bond pads electrically connected to the package substrate by way of bonding wires. A redistribution layer (RDL) stack can be disposed on a the first side of the integrated device die. The RDL stack can comprise an insulating layer and a conductive redistribution layer. The package can include a passive electronic device assembly mounted and electrically connected to the RDL stack.