Integrated Passive Die Layout for Flexible Interposer Integration
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Solution Overview
Problem
Existing integrated passive device dies have fixed sizes and electrical properties, limiting circuit design flexibility and integration possibilities.
Innovation Solution
The development of integrated passive device dies with customizable sizes and numbers of passive devices, achieved through selective dicing of semiconductor wafers with seal rings and alignment marks, allowing for varied configurations and improved electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If integrated passive device dies have fixed sizes and electrical properties, then manufacturing process is simplified, but circuit design flexibility is limited
Solution Approach 1:
The semiconductor wafer is divided into multiple individual dies, each containing a different number and configuration of integrated passive devices. This segmentation allows circuit designers to select specific dies with the exact configuration needed, while the manufacturing process remains standardized and simplified.
Solution Approach 2:
A single semiconductor wafer serves multiple functions by containing various types and numbers of integrated passive devices in different configurations. This universal approach allows the same manufacturing process to produce dies suitable for different circuit design requirements.
2Productivity
If multiple integrated passive devices are placed on a single die, then integration density increases, but die size increases
Solution Approach 1:
Instead of placing all integrated passive devices on a single large die, the wafer is segmented into multiple smaller dies, each containing a specific number and type of devices. This allows high integration density at the wafer level while keeping individual die sizes manageable for various application needs.
Solution Approach 2:
The solution moves from a two-dimensional constraint (single die size) to a three-dimensional approach by stacking multiple dies vertically or arranging them in modular configurations, effectively increasing integration density without proportionally increasing the area of any single die.
3Adaptability or versatility
If user-selectable die configurations are implemented, then circuit design flexibility improves, but manufacturing complexity increases
Solution Approach 1:
All possible die configurations are pre-fabricated on the semiconductor wafer during the manufacturing process. Alignment marks and scribe lines are pre-positioned to guide the dicing process. This preliminary action allows users to select different die configurations after manufacturing without adding complexity to the manufacturing process itself.
Solution Approach 2:
Multiple copies of different die configurations are created on a single wafer, each with identical alignment marks and structural features. This copying approach allows standardized manufacturing processes to produce varied die configurations that can be selected based on specific circuit design requirements.
Data Source
AI summary
An embodiment semiconductor device includes an interposer, a semiconductor die electrically connected to the interposer, an integrated passive device die electrically connected to the interposer, the integrated passive device die including two or more seal rings, and a first alignment mark formed on the integrated passive device die within a first area enclosed by a first one of the two or more seal rings. The integrated passive device die may further include two or more integrated passive devices located within respective areas enclosed by respective ones of the two or more seal rings. Each of the two or more integrated passive devices may include electrical connections that are formed as a plurality of micro-bumps, and the first alignment mark may be electrically isolated from the electrical connections, and the first alignment mark and the electrical connections may share a common material.