Pattern Measuring Device Using Reference Position Alignment
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Solution Overview
Problem
Current methods for measuring pattern deformation on semiconductor wafers lack a reliable criterion for position alignment between design data and actual patterns, making it difficult to evaluate deviations and deformations accurately.
Innovation Solution
A method is established where a reference position for measurement is set based on the positional relation between a reference pattern on an SEM image and design data, allowing for precise evaluation of pattern deviations and deformations by using position information from the SEM image and design data.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a reference position is set based on CAD data alone, then the measurement process is simple, but the measurement precision is insufficient due to lack of alignment criterion between design data and actual pattern
Solution Approach 1:
The patent introduces a reference pattern as an intermediary element that exists in both the CAD data and the actual SEM image. This reference pattern serves as a mediator to establish the positional relationship between design data and actual pattern, enabling accurate alignment and measurement without direct complexity between the two datasets
Solution Approach 2:
The patent creates a copy of the reference pattern from CAD data and superimposes it on the actual SEM image. By comparing the position of this copied reference pattern with the actual reference pattern in the image, the system establishes accurate positional alignment criteria for measuring pattern deviations
2Manufacturing precision
If edge detection method is used to measure pattern deformation, then the measurement can be performed, but the accuracy is limited due to no definite criterion for position alignment between design data and actual pattern
Solution Approach 1:
The patent replaces the manual or mechanical edge detection and alignment method with an automated image processing system. The system automatically detects the reference pattern in the SEM image, calculates its position, and uses this information to align the CAD data with the actual pattern, eliminating manual intervention and improving both speed and precision
Data Source
AI summary
A pattern measuring method and device are provided which set a reference position for a measuring point to be measured by a scanning electron microscope and the like, based on position information of a reference pattern on an image acquired from the scanning electron microscope and based on a positional relation, detected by using design data, between the measuring point and the reference pattern formed at a position isolated from the measuring point.