Patterned Phosphor Layer Structure for Vehicle Lighting Efficiency
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Solution Overview
Problem
Conventional vehicle lighting devices face challenges in maintaining light efficiency while implementing patterns, as concave patterns reduce phosphor layer thickness, leading to light diffusion issues and protruding patterns increase thickness, further deteriorating light efficiency.
Innovation Solution
A lighting device with a substrate, light sources, a resin layer, a phosphor layer with concave and convex patterns, and a diffusion layer between the resin and phosphor layers, where the diffusion layer's thickness is between 10% and 50% of the phosphor layer's thickness, effectively controlling light diffusion and aesthetics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If LEDs are mounted directly on a circuit board, then device complexity is reduced, but heat dissipation becomes insufficient leading to reduced reliability
Solution Approach 1:
The lighting device is segmented into distinct functional modules: LED modules mounted on heat sinks, which are then collectively mounted on the circuit board. This segmentation allows each LED module to have dedicated heat dissipation capability while maintaining overall device simplicity.
Solution Approach 2:
Heat sinks serve as intermediary components between the LEDs and the ambient environment. These heat sinks with integrated heat pipes act as thermal mediators that efficiently transfer heat away from LEDs, enabling reliable operation without requiring complex individual cooling solutions for each LED.
2Temperature
If heat sinks with large surface area are used, then heat dissipation improves, but device volume increases
Solution Approach 1:
The patent utilizes phase transition of working fluid within heat pipes to achieve efficient heat dissipation. The heat pipes employ phase change (evaporation and condensation) to transfer thermal energy, providing high heat dissipation capability with compact dimensions, thus avoiding the need for large surface area heat sinks.
3Temperature
If thermal paste is used between LED and heat sink, then heat transfer improves, but manufacturing precision requirements increase
Solution Approach 1:
The heat sink structure is designed to self-align with LED mounting holes through integrated定位 features. The heat sink includes positioning protrusions that fit into corresponding recesses on the circuit board, enabling automatic alignment during assembly without requiring high manufacturing precision or complex thermal interface materials.
4Ease of manufacture
If LEDs are mounted directly on circuit board, then ease of manufacture improves, but heat dissipation capability deteriorates
Solution Approach 1:
The patent merges multiple functions into integrated components. Heat sinks are designed with integrated mounting structures that combine thermal management and mechanical attachment functions. The LED modules are pre-assembled on heat sinks before mounting to the circuit board, simplifying the manufacturing process while ensuring adequate heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances light efficiency and maintains aesthetics by preventing light diffusion and exposure of the pattern layer, allowing for improved luminance and contrast control without increasing the device's thickness.
Implementation Method 1
Each of the light-emitting elements has a heat sink with a heat pipe for heat conductive connection to the light-emitting element
Implementation Method 2
Heat conductive connection
Data Source
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Figure 3~4
Figure 5(a)~6
AI summary
A lighting device disclosed in an embodiment of the invention includes a substrate; a plurality of light sources spaced apart from each other at predetermined intervals on the substrate; a resin layer disposed on the substrate; a phosphor layer disposed on the resin layer and having a pattern layer including a concave portion and a convex portion formed on a surface facing the resin layer; and a diffusion layer disposed between the resin layer and the phosphor layer, wherein a thickness of the diffusion layer may be 10% or more and less than 50% of the maximum thickness of the phosphor layer.