Patterned Shielding Structure for Inductor Eddy Current Reduction
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Solution Overview
Problem
As integrated circuit technology advances, the miniaturization of electrical elements leads to issues such as reduced quality factor values in inductors due to eddy currents generated by substrates during operation, which existing technologies have not effectively addressed.
Innovation Solution
A patterned shielding structure is introduced, comprising a shielding layer with a stacked structure that enhances the shielding effect by being disposed between the inductor structure and the substrate, reducing mutual inductance and preventing eddy currents, thereby maintaining or improving the quality factor value of the inductor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the inductor size is reduced for miniaturization, then the integrated circuit density is improved, but the quality factor value deteriorates due to eddy currents generated by the substrate
Solution Approach 1:
A shielding structure is introduced as an intermediary component between the inductor and the substrate. This shielding structure includes a shielding layer and a stacked structure with conductive material that blocks eddy currents generated by the substrate, thereby protecting the inductor's quality factor while maintaining miniaturization benefits
Solution Approach 2:
The shielding structure is segmented into multiple functional parts: a shielding layer extending along a plane and a stacked structure with crossed shapes disposed on the shielding layer. This segmentation allows the structure to effectively block eddy currents in multiple directions while occupying minimal space
2Ease of manufacture
If a traditional shielding layer is used alone, then the manufacturing process is simple, but the shielding effect is insufficient to fully prevent eddy currents
Solution Approach 1:
The shielding structure transitions from a two-dimensional shielding layer to a three-dimensional configuration by stacking crossed-shaped conductive structures on top of the shielding layer. This dimensional enhancement creates multiple blocking planes that more effectively prevent eddy currents while maintaining manufacturing feasibility through standard deposition processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The patterned shielding structure effectively reduces eddy currents and maintains or enhances the quality factor value of inductors, improving their performance by minimizing the impact of substrate-generated magnetic fields.
Implementation Method 1
The patterned shielding structure is disposed between an inductor structure and a substrate. The patterned shielding structure includes a shielding layer and a stacked structure. The stacked structure is configured to enhance a shielding effect.
Data Source
AI summary
A patterned shielding structure is disposed between an inductor structure and a substrate. The patterned shielding structure includes a shielding layer and a first stacked structure. The shielding layer extends along a plane. The first stacked structure is stacked, along a first direction, on the shielding layer. The first direction is perpendicular to the plane. The first stacked structure has a crossed shape and is configured to enhance a shielding effect.