Multi-Population Transformation for PCB Layer Alignment
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Solution Overview
Problem
Aligning circuit features created in different stages of the printed circuit board production process is challenging, leading to potential faults due to misalignment of holes, conductors, and solder mask, with existing methods limited in correcting alignment errors.
Innovation Solution
A method involving multi-population transformations is applied to circuit elements, where different transformation rules are specified for various elements to align hole pads with holes and contact pads with solder mask, while maintaining connectivity through geometrical adjustments and morphological operations, allowing precise alignment even with conflicting requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single uniform transformation is applied to all circuit elements, then the processing is simple, but alignment precision with features in different layers deteriorates
Solution Approach 1:
The patent divides the circuit elements into different populations (e.g., hole pads, contact pads, connecting elements) and applies different transformation rules to each population. This segmentation allows each element type to be transformed independently according to its specific alignment requirements with features in previous or subsequent layers, thereby achieving high alignment precision without requiring a single complex uniform transformation.
Solution Approach 2:
The patent applies different transformation rules (e.g., rigid transformation for hole pads, scaling transformation for contact pads) to different spatial locations and element types within the circuit pattern. This local quality approach ensures that each region of the pattern is transformed according to its specific requirements, improving overall alignment precision while keeping each local transformation relatively simple.
2Manufacturing precision
If different transformation rules are applied to different circuit elements, then alignment precision with features in different layers is improved, but the complexity of the transformation process increases
Solution Approach 1:
The patent segments the transformation process into distinct steps for different element populations. Each segment handles a specific type of element with its own transformation rules, making the overall complex process more manageable and easier to implement systematically rather than as a single monolithic transformation.
Solution Approach 2:
The patent changes transformation parameters (such as translation vectors, rotation angles, scaling factors) depending on the element type and its relationship with features in different layers. This parameter-based approach allows the system to adapt transformation characteristics dynamically while maintaining a consistent computational framework, balancing precision with ease of manufacture.
3Manufacturing precision
If hole pads are shifted to align with holes, then alignment with drilled holes is improved, but connectivity with contact pads may be compromised
Solution Approach 1:
The patent applies dynamic transformation rules that allow hole pads to be shifted to align with drilled holes while simultaneously adjusting connecting elements to maintain connectivity with contact pads. The transformation is not static but adapts to preserve both alignment and connectivity requirements through coordinated transformations of different element populations.
Solution Approach 2:
The patent applies different transformation characteristics to different elements: hole pads undergo transformation to align with holes, while connecting elements undergo complementary transformation to maintain their connectivity function. This local quality approach ensures that each element type is optimized for its specific function while maintaining overall circuit integrity.
4Manufacturing precision
If contact pads are anchored in predefined locations, then alignment with solder mask is improved, but flexibility in adjusting hole pad positions is reduced
Solution Approach 1:
The patent segments the pattern elements into anchored elements (contact pads) and transformable elements (hole pads, connecting elements). This segmentation allows contact pads to be fixed in predefined locations for solder mask alignment while hole pads and connecting elements retain transformation flexibility to adapt to variations in hole positions and maintain connectivity.
Solution Approach 2:
The patent applies different transformation constraints to different locations: contact pads have fixed transformation parameters (anchored), while hole pads and connecting elements have variable transformation parameters. This local quality approach provides adaptability where needed while maintaining precision where required.
Data Source
AI summary
A method for producing an electrical circuit includes providing a substrate having a first pattern of features and defining a second pattern comprising a net of interconnected circuit elements. Different respective transformation rules are specified for different ones of the circuit elements. The second pattern is modified by applying the respective transformation rules to the circuit elements so as to align the circuit elements with the features in the first pattern, and the modified second pattern is applied to the substrate.