A magnetically coupled support pin with bellows motion prevents substrate sagging while cutting space, cost, and positioning error.
Gold bump columns improve wetting for overlapping flexible circuit cables, reducing bridging and supporting stronger, lower-resistance RF interconnects.
Gold bump columns improve solder wetting for overlapping flexible circuit cables, reducing bridging risk and strengthening the bonded interface.
Added Z-axis measurement on the Y carriage and functional element captures vertical displacement for more accurate portal positioning.
A movable guiding sleeve aligns screws with PCB lock holes, improving placement accuracy and assembly efficiency during fastening.