A magnetically coupled support pin with bellows motion prevents substrate sagging while cutting space, cost, and positioning error.
Gold bump columns improve wetting for overlapping flexible circuit cables, reducing bridging and supporting stronger, lower-resistance RF interconnects.
Gold bump columns improve solder wetting for overlapping flexible circuit cables, reducing bridging risk and strengthening the bonded interface.
Added Z-axis measurement on the Y carriage and functional element captures vertical displacement for more accurate portal positioning.
A movable guiding sleeve aligns screws with PCB lock holes, improving placement accuracy and assembly efficiency during fastening.
Gold bumps create standoff for solder or conductive epoxy, improving flex cable attachment where overlap gaps raise resistance and bridging risk.
Flexible alignment rods containing internal capacitor elements trigger alarms when deformation exceeds thresholds, reducing false alarms and substrate damage.
Spline curve calculations map grid reference point shifts to correct wide-area substrate distortions, improving drawing precision.
A carrier positioning device flattens printed circuit boards using an abutment member to maintain precise component placement.
Vacuum gripper handles materials without electrostatic discharge while alignment pins ensure high tolerance placement.
Positional tracking links inspection results to board locations, allowing one checking machine to serve multiple lines and reduce system size.
Imaging system detects microscopic native features to align tools with workpieces, eliminating external alignment marks and reducing process complexity.