PCB Carrier Positioning Device for Bow and Twist Flattening

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Solution Overview

Problem

In the semiconductor industry, the placement of electrical components on printed circuit boards (PCBs) faces challenges due to the PCB's bow and twist, which exceed the depth of field of inspection cameras, making accurate positioning and adjustment difficult within the +/- 60 micrometer tolerance.

Innovation Solution

A carrier positioning device with an abutment member and a flattening member, utilizing a flattening unit and actuator to flatten the PCB, ensuring it is pressed against a flat abutment side, thereby maintaining the PCB's position within the camera's depth of field and allowing for precise placement of electrical components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the PCB is left in its natural state, then the manufacturing process is simple, but the PCB exhibits bow and twist exceeding the camera depth of field tolerance

Engineering Contradiction:
ImprovePCB positioning accuracyVSAvoidflattening unit and actuator mechanism
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The flattening unit is configured to flatten the PCB with its second surface against the flattening side before the first actuator presses the carrier against the abutment side. This preliminary flattening action removes bow and twist in advance, ensuring the PCB is within the camera depth of field tolerance before positioning operations begin.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The flattening member acts as an intermediary between the PCB and the positioning system. It provides a flattening side that contacts the second surface of the PCB, mediating the transformation from a bowed/twisted state to a flat state, enabling subsequent precise positioning within the camera depth of field.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Measurement precision

If the PCB is flattened and pressed against the abutment side, then the positioning accuracy within camera depth of field is achieved, but the device structure becomes more complex

Engineering Contradiction:
Improvecamera inspection accuracyVSAvoidcarrier positioning device structure
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The positioning device is segmented into distinct functional modules: a flattening unit with a flattening member for removing bow and twist, and a positioning mechanism with an abutment member and first actuator for precise positioning. This segmentation allows each module to perform its specific function independently, achieving camera inspection accuracy while maintaining manageable device complexity through modular design.

Inventive Principle:
Principle #1Segmentation

3Stability of the object's composition

If the carrier is clamped between abutment member and flattening member, then positioning stability is improved, but the opening for component placement must be designed

Engineering Contradiction:
Improvecarrier positioning stabilityVSAvoidopening design in abutment member
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The abutment member is designed with a localized opening that exposes the first central region of the PCB while maintaining clamping stability at the edges. This local quality approach allows the majority of the carrier to be securely clamped between the abutment member and flattening member for stability, while a specific local region (the opening) provides access for component placement operations.

Inventive Principle:
Principle #3Local quality

Data Source

PatentEP4333585A1Carrier positioning device
Publication Date: 2024.03.06 NEXPERIA BV
  • EP4333585A1 patent drawingFigure 1
  • EP4333585A1 patent drawingFigure 2
  • EP4333585A1 patent drawingFigure 3

AI summary

Aspects of the present disclosure relate to a carrier positioning device for positioning a carrier, such as a printed circuit board, and to a pick-and-place device comprising the same. Aspects of the present disclosure further relate to a method for positioning a carrier, such as a printed circuit board, and to a method for arranging an electrical component on a carrier. The carrier comprises a first surface and a second surface, wherein the first surface comprises a first central region on which electrical components are to be arranged, and a first edge region adjacent to the first central region. According to an aspect of the present disclosure, the carrier is flattened on a flattening side of a flattening member. The flattening member with the carrier on the flattening side is moved such that the carrier is pressed with its first surface against a flat abutment side of an abutment member. The abutment member is configured to leave an opening exposing the first central region when the carrier is in abutment with the flat abutment side.