Automated PCB Layup Robot with Vacuum Gripper and Alignment Pins
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Solution Overview
Problem
Conventional PCB manufacturing processes are manual, costly, and time-consuming, particularly in the board layup operation, due to issues like electrostatic discharge, material damage, and high tolerance alignment, which existing automation solutions fail to address effectively.
Innovation Solution
An automated robotic device with a movable arm and end effector system that includes vacuum tools and suction cups, capable of accurately placing laminate sheets and bond films on a fixture with alignment pins, reducing manual labor and improving precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual board layup operation is performed by hand-placing laminate sheets and bond films, then flexibility and adaptability are maintained, but productivity is low and manufacturing precision is poor
Solution Approach 1:
The patent replaces manual mechanical handling with an automated robotic system that uses vacuum suction cups to grasp and position laminate sheets and bond films. The robotic arm with programmable control replaces human hands, achieving high-speed automated layup while maintaining precise placement through computer-controlled motion and alignment features.
Solution Approach 2:
The system incorporates self-alignment features where alignment pins on the fixture automatically guide the placement of laminate sheets and bond films. The vacuum gripper system automatically adjusts to maintain proper suction contact, and the robotic controller autonomously manages the entire layup sequence without human intervention.
2Productivity
If existing automation solutions like electro-adhesion robot gripper or suction cup mechanism are used, then productivity is improved, but electrostatic discharge and surface damage occur
Solution Approach 1:
The patent employs a vacuum-based pneumatic system using suction cups to grasp and handle laminate sheets and bond films. This pneumatic approach replaces electro-adhesion methods, eliminating electrostatic discharge risks while maintaining secure holding during transfer operations. The vacuum system provides gentle, uniform contact that prevents surface damage.
Solution Approach 2:
The suction cups are designed as flexible elements that conform to the surface of laminate sheets and bond films without exerting excessive localized pressure. This flexibility allows the gripper to adapt to slight variations in material surface while distributing holding forces evenly, preventing surface damage to the sensitive PCB materials.
3Manufacturing precision
If automated placement is implemented, then productivity and manufacturing precision are improved, but device complexity increases
Solution Approach 1:
The patent introduces alignment pins as intermediary elements that physically bridge the robotic placement system and the laminate/bond film stackup. These pins provide fixed reference points that guide the vacuum gripper to precise locations, enabling high-accuracy placement without requiring complex vision systems or sophisticated control algorithms.
Solution Approach 2:
The system achieves precision through controlled parameter changes in the robotic arm motion and vacuum gripper positioning. By programmatically adjusting movement speed, position, and vacuum pressure parameters, the system maintains high precision placement while using relatively simple mechanical components compared to more sophisticated automated systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables faster, more precise, and cost-effective automated PCB layup operations, reducing the risk of electrostatic discharge and material damage while achieving high tolerance alignment, thus enhancing the efficiency and accuracy of PCB fabrication.
Implementation Method 1
The bottom floating plate may include a plurality of suction cups, which are configured to releasably secure the laminate sheet to the bottom floating plate. Each suction cup may be secured to a vacuum source, and by applying vacuum to the suction cups, the bottom floating plate releasably secures the laminate sheet to the bottom floating plate
Implementation Method 2
The top floating plate may include a plurality of ports, which are connected to a source of air. The ports provide an air cushion between the top floating plate and the fixed plate to facilitate a small amount of movement between the top and bottom floating plates and the fixed plate when aligning the bottom floating plate with one of the laminate sheet, bond film and board layup fixtures
Data Source
AI summary
An apparatus to automatically place layers of a printed circuit board on a fixture includes a robotic device having a base that is secured to a surface, an upright column that extends upwardly from the base, and a movable arm rotatably coupled to the upright column. The movable arm is configured to rotate about a vertical axis defined by the upright column. The movable arm is further configured to rotate from a position in which the movable arm is disposed over a laminate sheet fixture and to pick up a laminate sheet to a position in which the movable arm is disposed over a board layup fixture to deposit the laminate sheet in the board layup fixture, and from a position in which the movable arm is disposed over a bond film fixture and to pick up a bond film to a position in which the movable arm is disposed over the board layup fixture to deposit the bond film in the board layup fixture.