Substrate Distortion Correction via Spline Displacement Calculation
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Solution Overview
Problem
Existing direct drawing apparatuses struggle to achieve satisfactory drawing quality on substrates that undergo deformation such as warpage or distortion, as they are not designed to account for non-local distortions, leading to misalignment and reduced yield.
Innovation Solution
A displacement calculation method that uses a grid of reference points to calculate target point displacements through spline curve calculations in both coordinate axes, allowing for accurate perception and correction of wide-area substrate distortions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If correction amounts are calculated from position information of four neighboring points surrounding target drawing data, then correction for local distortion of substrate is possible, but precise correction cannot be made when distortion occurs over larger area of substrate
Solution Approach 1:
The substrate surface is divided into multiple measurement regions with reference points arranged in a grid pattern. Each region's distortion is measured independently, and the correction is applied locally while maintaining continuity across the entire substrate. This segmentation allows the system to handle both local and wide-area distortions effectively.
Solution Approach 2:
The invention transitions from using only four neighboring points (2D local correction) to utilizing reference points arranged in a grid across the entire substrate surface (2D to 3D expansion). By incorporating reference points from multiple rows and columns, the system can perceive distortion tendencies over wide areas and apply comprehensive correction across the whole substrate.
2Ease of manufacture
If design data is created without consideration of substrate deformation, then design simplicity is maintained, but misalignment with previously formed circuit pattern occurs
Solution Approach 1:
The system performs measurement and correction calculations before the actual drawing process. By measuring the substrate surface in advance and calculating correction amounts for each target point based on reference point displacements, the system prepares corrected drawing data that compensates for substrate deformation. This preliminary action ensures that the design data can remain simple while the correction is applied during the drawing preparation phase.
3Productivity
If conventional local alignment correction is used, then processing speed is maintained, but drawing quality deteriorates on substrates with wide-area distortion
Solution Approach 1:
The invention replaces complex mechanical measurement and adjustment systems with a computational approach. By using image processing to detect reference point positions and applying spline curve calculations to determine displacement fields, the system achieves wide-area distortion correction through software algorithms rather than mechanical intervention, maintaining processing speed while improving drawing quality.
Data Source
AI summary
Correction values (ΔX1 to ΔX4) at the X position (X=xe) of a target point (E (xe, ye)) are calculated by calculating the amounts of shift (ΔX) in the positions of alignment marks (M11 to M14, M21 to M24, M31 to M34, M41 to M44) in the X direction and plotting first spline curves (SL1) using the amounts of shift. Then, a first sub-spline curve (SL1S) is plotted using the correction values (ΔX1 to ΔX4) in order to calculate a correction value (ΔXe) at the Y position (Y=ye) of the target point (E (xe, ye)), and the calculated correction value is taken as the correction amount in the X direction. The correction amount in the Y direction is also calculated in the same manner.