PCB-to-Antenna EBG Interconnection for Low-Loss Leakage Control

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Solution Overview

Problem

Achieving a low loss transition between a PCB and an antenna module while preventing electromagnetic signal leakage is challenging, which can damage or interfere with surrounding equipment.

Innovation Solution

The use of solder balls soldered onto a PCB to form an electromagnetic band gap (EBG) structure, allowing for a contactless transition that reduces losses and leakage, enabling easier assembly and tolerance for manufacturing errors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If direct electrical contact is made between PCB and antenna module to achieve good electrical contact, then transition performance is improved, but assembly difficulty increases and manufacturing precision requirements increase

Engineering Contradiction:

Improvetransition performanceVSAvoidassembly difficulty

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces the mechanical direct-contact electrical connection system with an electromagnetic field-based coupling system. The solder balls form an EBG structure that creates electromagnetic coupling between the PCB and antenna module without requiring direct physical contact, thereby eliminating assembly alignment issues while maintaining good transition performance through electromagnetic field interaction

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The solder balls arranged in an EBG structure serve as an intermediary between the PCB and antenna module. Instead of direct contact, the EBG structure mediates the electromagnetic energy transfer through its electromagnetic bandgap properties, allowing energy coupling while maintaining physical separation and tolerating manufacturing variations

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If direct electrical contact is made between PCB and antenna module, then electrical connection is improved, but electromagnetic signal leakage increases

Engineering Contradiction:

Improveelectrical connectionVSAvoidelectromagnetic signal leakage

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent converts the typically harmful electromagnetic signal leakage into a beneficial containment effect. By arranging solder balls to form an EBG structure, the electromagnetic fields that would normally leak are instead confined within the waveguiding space, transforming potential harm into useful signal containment and improving overall system performance

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Ease of manufacture

If solder balls are arranged to form EBG structure for contactless transition, then assembly ease is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improveassembly easeVSAvoidsolder ball arrangement precision

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent utilizes changes in electromagnetic parameters (bandgap frequency, waveguiding characteristics) achieved through the periodic arrangement of solder balls. By optimizing the spacing and arrangement parameters of the solder balls, the system achieves contactless electromagnetic coupling with broad tolerance to manufacturing variations, transforming a precision mechanical problem into a robust electromagnetic design

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The EBG structure provides excellent transition performance with low losses and low leakage, facilitating a more space-efficient and compact antenna arrangement.

Implementation Method 1

The solder balls are arranged to form an electromagnetic band gap, EBG, structure together with the conductive second major surface of the antenna module and the conductive layer of the first major surface of the PCB, and wherein the EBG structure delimits a waveguiding space

Methodology Applied

Scientific EffectElectromagnetic band gap (EBG) structure:

Implementation Method 2

the antenna module which guides electromagnetic waves to/from the PCB into the environment

Methodology Applied

Scientific EffectWaveguide: Waveguide

Data Source

PatentUS20250350035A1Contactless interconnection between PCB and antenna assembly

Publication Date: 2025.11.13 GAPWAVES AB

AI summary

The present disclosure relates to an antenna arrangement (10) comprising a PCB (1) a plurality of solder balls (16) soldered on the first major surface (la) of the PCB (1), the PCB (1) further comprising a conductive layer (12a) connecting the solder balls (16) at their bases. The antenna arrangement further comprises an antenna module (2) comprising a second major surface (2b) which is electrically conductive and at least one waveguide opening (23) and at least one antenna aperture (22), wherein the antenna module (2) is arranged with the second major surface (2b) facing the PCB (1). The solder balls (16) are arranged to form an EBG structure together with the conductive second major surface (2b) of the antenna module (2) and the conductive layer of the first major surface (la) of the PCB (1), and the antenna arrangement (10) further comprises a transmitting and/or receiving component (3).