PCB Backup Pin Positioning for Vibration Suppression
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Solution Overview
Problem
Substrate deflection during inspection and component mounting leads to inaccurate inspection and increased likelihood of mounting failure due to uneven support and vibration, which existing techniques fail to adequately address without increasing costs.
Innovation Solution
A substrate inspection and component mounting device that uses backup pins supported by a location determiner to identify and place pins at areas where the electrode is covered by resist film, ensuring consistent protrusion length and reducing vibration, thereby improving inspection accuracy and reducing mounting failures without increasing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If backup pins are used to support the rear face of the substrate, then substrate deflection is suppressed, but vibration occurs due to gaps between pins and substrate surface
Solution Approach 1:
The patent applies local quality by differentiating support strategies based on local substrate characteristics. Backup pins are selectively positioned at areas where the resist film is present (providing thicker support), while avoiding areas with thin electrodes or solder paste. This localized adaptation ensures consistent contact between pins and substrate surface, eliminating gaps that cause vibration while maintaining deflection suppression.
Solution Approach 2:
The patent employs preliminary action by using an image processing device to analyze the substrate surface topology before positioning the backup pins. The system pre-identifies suitable support areas based on image data, determining optimal pin locations that avoid regions with thin electrodes or solder paste. This preliminary analysis ensures that pins are placed only on areas with sufficient thickness, preventing vibration before it occurs.
2Object-affected harmful factors
If suction-type backup pins are used to suppress substrate vibration, then vibration is reduced, but substrate is depressed toward the pins requiring increased depth of field
Solution Approach 1:
The patent inverts the conventional suction-type approach by using non-suction backup pins that rely on precise positional placement rather than active holding force. Instead of sucking the substrate toward the pins (which causes depression), the pins are positioned so far from the inspection surface that they provide support without contact during inspection. This inversion eliminates both vibration and depression issues.
Solution Approach 2:
The patent introduces an intermediary element - the image processing device - that mediates between the backup pin positioning system and the substrate. This intermediary analyzes substrate topology and determines optimal pin locations, acting as an intelligent intermediary that prevents direct harmful interaction between pins and substrate while ensuring adequate support. The intermediary enables precise positioning without requiring active suction forces.
3Device complexity
If backup pins are placed without discrimination of areas, then device complexity is reduced, but large gaps form between pins and substrate surface
Solution Approach 1:
The patent applies self-service by enabling the backup pin positioning system to automatically identify and select appropriate support areas through image processing. The system serves itself by using image data to autonomously determine pin locations without requiring complex external guidance or manual intervention. This self-service capability achieves precise pin placement (avoiding gaps) while maintaining relatively simple device architecture.
Solution Approach 2:
The patent replaces the mechanical trial-and-error approach of pin placement with an optical/image processing system. Instead of relying on mechanical feedback or complex positioning mechanisms, the system uses image data to intellectually determine optimal pin locations. This substitution of mechanical complexity with optical/intellectual processing achieves precise placement while keeping the overall device structure relatively simple.
Data Source
AI summary
A substrate inspection device and a component mounting device are provided. The solder inspection device and the component mounting device respectively have substrate support devices that support a rear face of a printed circuit board. The substrate support device includes backup pins that support the rear surface of the printed circuit board, a location determiner that determines locations of the backup pins, and a backup pin locator that places the backup pins at the locations of the backup pins determined by the location determiner. The location determiner determines positions for supporting areas of the rear face of the printed circuit board where an electrode is covered by a resist film and where neither electronic component nor solder is present, as the locations of the backup pins.