PCB Bending Part Through Hole Wiring Protection
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Solution Overview
Problem
Conventional printed circuit boards suffer damage to their wiring during bending treatments, leading to defects and increased width in liquid crystal display devices, as the insulating substrate and string wiring in the bending parts are prone to ripping or pressing.
Innovation Solution
A printed circuit board design featuring a through hole in the bending part between the first and second areas, with connection wiring disposed within this hole, and wiring formed on the rear surface of the area with mounted light emitting devices, to prevent damage and minimize width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If bending treatment is performed on the printed circuit board to reduce device width, then the width of the liquid crystal display device is reduced, but the insulating substrate or string wiring within the bending part is damaged such as being ripped or pressed
Solution Approach 1:
The printed circuit board is divided into a first area (rigid region) and a second area (flexible region) separated by a bending part. This segmentation allows the board to be bent only in the designated second area without damaging the wiring, as the bending part acts as a dedicated flexible zone that isolates the stress from critical components and connections in the first area.
Solution Approach 2:
The bending part serves as an intermediary element between the rigid first area and the flexible second area. It mediates the mechanical stress during bending by providing a designated flexible zone that protects the insulating substrate and wiring from direct damage, allowing width reduction while maintaining structural integrity.
2Ease of manufacture
If the string wiring is formed in the bending part to connect light emitting devices, then the electrical connection is established, but the wiring is damaged upon bending causing defects
Solution Approach 1:
The wiring layout is segmented such that the string wiring connecting light emitting devices is positioned entirely within the second area (flexible region) away from the bending part, while the bending part remains clear of critical wiring. This segmentation ensures that bending operations do not damage the wiring, maintaining both manufacturing ease and precision.
Solution Approach 2:
The critical wiring paths are extracted from the bending part area and relocated to the second area. By removing the wiring from the bending zone, the bending operation can be performed without risking wiring damage, thus maintaining wiring integrity while still enabling the bending treatment for width reduction.
3Length of stationary object
If the printed circuit board width is reduced by minimizing the pad part or string part, then the device width is reduced, but the wiring becomes more susceptible to damage during bending
Solution Approach 1:
The PCB is segmented into a compact first area for mounting light emitting devices and a second area that can be bent. This segmentation allows the overall board width to be minimized while protecting the wiring by positioning it in the second area away from the bending stress concentration zone, thereby maintaining wiring strength despite reduced dimensions.
Solution Approach 2:
The wiring layout transitions from a conventional planar arrangement to a three-dimensional configuration where the string wiring is positioned on the rear surface of the first area and extends into the second area. This dimensional repositioning allows the wiring to bypass the bending part or be positioned where it will not suffer damage during bending, maintaining strength in a compact design.
Data Source
AI summary
Provided is a printed circuit board including: a support substrate including a first area in which a light emitting device is mounted, and a second area extending from the first area; a bending part which is configured such that a part between the first area and the second area is bent; a through hole passing through the bending part; a connection wiring connected to the light emitting device and disposed on the bending part; and a wiring connected to the connection wiring.