PCB Bilayer Insulating Film for Thin-Layer Short Prevention

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Solution Overview

Problem

The reduction in insulation layer thickness in printed circuit boards leads to increased issues with interlayer short circuits and migration due to foreign substances, scratches, or damage, and signal loss due to roughness.

Innovation Solution

Embedding conductor patterns in multiple insulating layers with a bilayer structure of inorganic and organic layers on the surface and between layers to enhance adhesion and reduce roughness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the thickness of the insulating layer is reduced to form microcircuits and microvias, then miniaturization and integration density are improved, but the risk of interlayer short circuits and migration due to foreign substances increases

Engineering Contradiction:

Improveinsulating layer thicknessVSAvoidinterlayer short circuit prevention

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The patent applies composite materials by forming a dual-layer insulating film structure consisting of an inorganic insulating film layer and an organic insulating film layer. The inorganic layer provides excellent barrier properties against foreign substance penetration and migration, while the organic layer provides good adhesion and filling properties. This composite structure effectively prevents interlayer short circuits even when the overall insulating layer thickness is reduced for miniaturization.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent segments the insulating film into multiple functional layers: an inorganic insulating film layer and an organic insulating film layer. Each layer performs a specific function - the inorganic layer acts as a barrier against foreign substances and migration, while the organic layer provides adhesion and conformal coverage. This segmentation allows the system to maintain reliability with reduced overall thickness.

Inventive Principle:

Principle #1Segmentation

2Volume of moving object

If the thickness of the insulating layer is reduced, then miniaturization is improved, but susceptibility to scratches and damage increases

Engineering Contradiction:

Improveinsulating layer thicknessVSAvoidscratch resistance

Core Design Contradiction:

Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The composite insulating film structure with inorganic and organic layers provides enhanced mechanical protection. The inorganic layer offers hardness and scratch resistance, while the organic layer provides toughness and flexibility. This combination maintains surface integrity and resistance to damage even with reduced overall thickness.

Inventive Principle:

Principle #40Composite materials

3Strength

If a rough surface treatment is applied to the conductor pattern, then adhesion is improved, but signal loss increases

Engineering Contradiction:

Improveadhesion between conductor and insulatorVSAvoidsignal loss

Core Design Contradiction:

StrengthVSLoss of energy

Solution Approach 1:

The organic insulating film layer provides conformal coverage and excellent adhesion to the conductor pattern surface, while the inorganic layer provides a smooth upper surface. This composite structure achieves strong adhesion without requiring rough surface treatment, thereby minimizing signal loss.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent applies different properties to different parts of the insulating film structure: the lower organic layer provides adhesion quality at the conductor interface, while the upper inorganic layer provides smooth surface quality for signal transmission. This local differentiation of properties resolves the contradiction between adhesion and signal loss.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves adhesion between conductor patterns and insulating layers, reduces signal loss, and effectively prevents interlayer short circuits and migration issues.

Implementation Method 1

forming an insulating film including an inorganic layer and an organic layer on a surface of a conductor pattern

Methodology Applied

Scientific EffectPhysical Vapour Deposition: Physical Vapour Deposition

Implementation Method 2

forming an insulating film including an inorganic layer and an organic layer on a surface of a conductor pattern

Methodology Applied

Scientific EffectChemical Vapour Deposition: Chemical Vapour Deposition

Implementation Method 3

a first insulating film covering at least a portion of the first conductor pattern and conforming to a shape of a surface of the first conductor pattern

Methodology Applied

Scientific EffectConformal Deposition: Deposition (physical)

Data Source

PatentUS20260040440A1Printed circuit board

Publication Date: 2026.02.05 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

A printed circuit board including: a first conductor pattern; a first insulating film covering at least a portion of the first conductor pattern conforming to a shape of a surface of the first conductor pattern; and an insulating layer disposed on the first insulating film, the first insulating film including a first inorganic layer and a first organic layer.