PCB Dielectric Channel Traces for Uniform High-Current Routing

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional PCB manufacturing processes result in non-uniform trace cross-sections, material wastage, and the use of hazardous chemicals, which are inefficient and environmentally harmful, especially when producing PCBs that require high current carrying capabilities.

Innovation Solution

The development of an additive system for PCB construction, involving the use of a dielectric substrate with channels and pockets that are filled with conductive material via electrolytic metallization, allowing for the creation of conductive layers with specific thicknesses and minimizing material waste.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional etching process is used to form PCB traces, then traces can be created on dielectric substrate, but the trace cross-section becomes non-uniform with tapered side walls resulting in volume loss and higher resistance

Engineering Contradiction:

Improvetrace cross-section uniformityVSAvoidconductive material volume

Core Design Contradiction:

Manufacturing precisionVSLoss of substance

Solution Approach 1:

Instead of removing material to form traces (etching), the invention deposits conductive material into recesses to build up traces. The mold cavities are formed with complementary geometry to the desired trace cross-section, and conductive material is deposited into these cavities, inverting the conventional subtractive approach to an additive approach that produces uniform cross-sections without material loss.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The mold cavities and recesses are pre-formed in the dielectric substrate before conductive material deposition. These pre-formed features have geometry that is complementary to the desired final trace cross-section, ensuring that when material is deposited, the uniform cross-section is achieved automatically without requiring post-processing or precise control of deposition thickness.

Inventive Principle:

Principle #10Preliminary action

2Reliability

If thicker conductive foil is used to increase current carrying capability, then high current capacity is achieved, but material cost and weight increase

Engineering Contradiction:

Improvecurrent carrying capabilityVSAvoidconductive material amount

Core Design Contradiction:

ReliabilityVSQuantity of substance

Solution Approach 1:

Instead of using uniformly thick conductive foil across the entire PCB, the invention deposits conductive material only where needed - specifically into the pre-formed mold cavities and recesses. This allows for variable trace thicknesses optimized for local current requirements, achieving high current carrying capability in critical areas while minimizing material usage in lower-current areas.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The invention changes the thickness parameter of conductive material locally by controlling the depth and geometry of mold cavities and recesses. Areas requiring high current carry higher thicknesses of deposited material, while other areas have lower thicknesses, optimizing the balance between current carrying capability and material usage.

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If conventional etching process is used, then PCB traces can be formed, but hazardous chemicals are required and material wastage occurs

Engineering Contradiction:

Improvetrace formation capabilityVSAvoidhazardous chemicals and environmental impact

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The invention replaces the chemical etching process with a mechanical/mold-based approach. Instead of using hazardous chemicals to remove material, pre-formed mold cavities and recesses mechanically define the trace geometry. Conductive material is then deposited into these pre-formed features, eliminating the need for hazardous etching chemicals while maintaining trace formation capability.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention converts the harmful subtractive etching process into a beneficial additive deposition process. By pre-forming mold cavities with complementary geometry, the approach not only eliminates hazardous chemicals but also ensures precise trace geometry and uniform cross-sections, turning a problematic process into an advantageous manufacturing method.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the production of PCBs with uniform conductive layers, improved current carrying capacity, reduced material usage, and a more environmentally friendly manufacturing process, specifically suited for high current applications.

Implementation Method 1

a mold cavity is filled with molten thermoplastic material to form a three-dimensional dielectric substrate with channels and recesses

Methodology Applied

Scientific EffectInjection molding:

Implementation Method 2

the channels and recesses are filled with conductive material via electrolytic metallization

Methodology Applied

Scientific EffectElectrolytic metallization: Electrodeposition

Data Source

PatentUS20250133654A1Printed circuit board dielectric molding, machining and wire insertion

Publication Date: 2025.04.24 INFINITUM ELECTRIC INC

AI summary

A printed circuit board (PCB) has a dielectric substrate of fiber-reinforced polymer with opposite sides. Each side has channels formed by molding or machining the dielectric substrate. Conductive wires are inserted into the channels to define conductive traces.