Plastically Deformable Fixing Element for PCB Component Thermal Alignment
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Solution Overview
Problem
In electrical circuits with multiple components to be cooled, the varying heights due to manufacturing tolerances lead to reduced thermal contact and increased thermal resistance when using a common heat sink, causing mechanical stress and potential damage, especially in smaller packaging variants.
Innovation Solution
A plastically deformable fixing element is used to align heat dissipation surfaces of components to the same plane, compensating for different component heights through elastic deformation, allowing for uniform pressure distribution and stress-free arrangement, which enables a precise press fit and improved thermal contact without mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a common heat sink is used to cool multiple components, then heat dissipation is achieved, but thermal contact is reduced due to varying component heights
Solution Approach 1:
The patent applies compliant mounting structures that change their mechanical parameters (flexibility, elasticity) to accommodate variations in component height. These structures allow the heat sink to maintain consistent thermal contact with components of different heights by deforming elastically, thereby resolving the contradiction between heat dissipation effectiveness and manufacturing tolerance variations.
Solution Approach 2:
The patent introduces compliant mounting structures as intermediary elements between the rigid heat sink and the components with varying heights. These intermediaries absorb the height variations through their compliance, ensuring that the heat sink maintains uniform thermal contact with all components regardless of their individual height differences.
2Temperature
If pressure is applied to achieve uniform thermal contact, then thermal contact improves, but mechanical stress increases in solder joints
Solution Approach 1:
The patent transforms the mounting structure from rigid to compliant, allowing it to deform elastically under pressure. This parameter change enables the structure to apply sufficient pressure for uniform thermal contact while distributing the mechanical stress through deformation, thereby protecting the solder joints from excessive stress and maintaining reliability.
Solution Approach 2:
The compliant mounting structures act as cushioning elements that are designed to deform before the excessive stress reaches the solder joints. This beforehand cushioning protects the fragile solder connections by absorbing and distributing the mechanical stress, preventing solder joint failure while still achieving the necessary pressure for thermal contact.
3Temperature
If elastic deformation is used to compensate for height differences, then thermal contact uniformity improves, but component displacement under vibration increases
Solution Approach 1:
The patent optimizes the compliance parameters of the mounting structures to provide sufficient elasticity for height compensation while maintaining enough rigidity to resist vibration-induced displacement. By carefully tuning the mechanical properties (elastic modulus, geometry) of these structures, the system achieves both uniform thermal contact and vibration resistance.
Solution Approach 2:
The patent employs dynamic mounting structures that can adapt their stiffness characteristics. These structures are designed to be compliant under static or low-frequency conditions to accommodate height variations, yet sufficiently rigid under high-frequency vibration conditions to prevent component displacement, thus resolving the contradiction between thermal contact uniformity and vibration resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures consistent thermal contact across all components, enhances mechanical resilience, and extends the service life of the electrical circuit by maintaining uniform pressure distribution and resistance to shock and vibration, while avoiding mechanical stress and solder joint failure.
Implementation Method 1
A plastically deformable fixing element is used to align heat dissipation surfaces of components to the same plane, compensating for different component heights through elastic deformation
Implementation Method 2
allowing for uniform pressure distribution and stress-free arrangement, which enables a precise press fit and improved thermal contact
Implementation Method 3
ensures consistent thermal contact across all components, enhances mechanical resilience, and extends the service life of the electrical circuit by maintaining uniform pressure distribution
Data Source
Figure 1
AI summary
The invention relates to a method for populating a circuit board with a plurality of components. The method comprises the steps of: providing the components with push-through contacts extending at least in end segments of the push-through contacts in a direction perpendicular to the heat emitting surfaces of the components, and providing the circuit board with contact holes for receiving push-through contacts. At least one plastically deformable fixing element is further mounted on the circuit board. The components are mounted on the fixing element and the push-through contacts are inserted into the corresponding contact holes of the circuit board. A flat surface displaces the heat surfaces of the components toward the circuit board, plastically deforming the fixing element, until all heat emitting surfaces of the components lie in the same plane. The invention further relates to an electrical circuit having a circuit board, wherein heat emitting surfaces are connected to the circuit board by means of at least one plastically deformable fixing element, wherein the heat emitting surfaces are flush with each other because the fixing element that has been correspondingly plastically deformed compensates for the different component thicknesses.