PCB Cooling Device with Integrated Heat Conduction Layer
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Solution Overview
Problem
Existing cooling devices for printed circuit board components often require increased installation effort and may not adequately meet demanding thermal requirements, as they fail to separate effectively the mountability and cooling capacity requirements.
Innovation Solution
A cooling device with a plastic heat-conducting element socket that positions heat-conducting elements relative to the printed circuit board, utilizing a flexible and vibration-damping circuit board heat conduction layer, and a metal housing with rib structures for enhanced heat dissipation, along with connecting elements for secure mechanical attachment, allowing for automated assembly and easy disassembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional heat sinks with rib structures are used for cooling printed circuit board components, then cooling capacity is improved, but installation effort increases
Solution Approach 1:
The patent merges the cooling function directly into the printed circuit board by integrating a heat-conducting layer into the board structure itself. This eliminates the need for separate heat sink components and their associated installation efforts, while maintaining effective heat dissipation from electronic components.
Solution Approach 2:
The printed circuit board serves multiple functions: it provides electrical connections, mechanical support, and thermal management. By incorporating the heat-conducting layer into the board, the board becomes a multi-functional component that handles both signal transmission and heat dissipation, reducing the need for additional cooling components.
2Temperature
If components are connected to heat sinks using clamps or screws, then cooling capacity is improved, but installation complexity and cost increase
Solution Approach 1:
The cooling function is merged into the circuit board structure through an integrated heat-conducting layer, eliminating the need for separate heat sinks and their associated mounting hardware. This integration simplifies the overall device structure and reduces installation complexity.
Solution Approach 2:
The patent extracts the heat-conducting function from separate cooling components and integrates it directly into the circuit board. This extraction and integration approach eliminates the need for complex assembly operations involving clamps, screws, or other mounting mechanisms.
3Temperature
If additional insulation and mounting components are used for heat sink integration, then cooling capacity is improved, but manufacturing cost increases
Solution Approach 1:
The heat-conducting layer is merged into the circuit board manufacturing process itself, allowing thermal management to be produced as an integrated feature rather than a separate assembly. This integration eliminates the need for additional insulation components and mounting hardware, reducing overall manufacturing costs.
Solution Approach 2:
The heat-conducting layer is incorporated into the circuit board during the initial manufacturing process, before final assembly. This preliminary integration of the cooling function allows for more efficient production and eliminates the need for subsequent assembly steps involving additional components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively addresses demanding thermal and electrical requirements, ensuring reliable heat transfer and efficient cooling while simplifying the installation process and accommodating assembly tolerances, with the ability to be manufactured automatically and removed without residue.
Implementation Method 1
The at least one heat conductor (8) contributes to effective cooling by the cooling device (5)
Implementation Method 2
plastic heat-conducting element socket (7) which positions the heat-conducting element (8) in relation to the printed circuit board (2)
Implementation Method 3
The circuit board heat conduction layer ensures good heat transfer between the heat conducting element and the component to be cooled mounted on the circuit board
Implementation Method 4
The printed circuit board heat conduction layer can be designed to be flexible
Implementation Method 5
The printed circuit board heat conduction layer can be designed to be vibration-damping
Implementation Method 6
a metal housing with rib structures for enhanced heat dissipation
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
A cooling device for at least one component mounted on a circuit board has at least one thermal conductivity element and a plastic thermal conductivity element socket (6) with at least one thermal conductivity element receptacle (7). An electrically insulating circuit board thermal conductivity layer (9) covers the thermal conductivity element socket (6) on the circuit board side when the cooling device is mounted and is in direct thermal contact with the thermal conductivity element. This results in a cooling device that can meet even demanding thermal requirements for the components to be cooled.