PCB Cooling via Embedded Power Pillars and Internal Flow Paths
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Solution Overview
Problem
Conventional cooling methods for heat generating components on printed circuit boards (PCBs) face challenges due to high thermal resistance from multiple intervening layers, making it difficult to maintain proper case temperature for high power electronics.
Innovation Solution
A multi-layer PCB assembly is designed with a second PCB that defines a cooling path and power pillars extending from the first PCB through the cooling path to the third PCB, allowing for efficient heat transfer and coolant circulation without the need for special fabrication techniques or cold plates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cold plate cooling methods are used with multiple intervening layers, then cooling coverage is provided, but thermal resistance increases making it difficult to maintain proper case temperature
Solution Approach 1:
The invention extracts the cooling function from a separate cold plate component and integrates it directly into the PCB structure itself. The PCB incorporates cooling channels and heat dissipation features within its layers, eliminating the need for external cold plates and reducing the number of thermal interfaces. This integration reduces thermal resistance by removing intervening layers between the heat-generating components and the cooling medium.
Solution Approach 2:
The invention merges the structural function of the PCB with the thermal management function by integrating cooling channels, heat sinks, or phase change materials directly into the PCB layers. This combination allows the PCB to simultaneously serve as both the electrical circuit substrate and the thermal management system, reducing thermal resistance through direct thermal coupling without additional intervening layers.
2Temperature
If 3D printing or sintering techniques are used to provide microfluid channels, then cooling performance improves, but manufacturing complexity and cost increase
Solution Approach 1:
The invention uses standard PCB manufacturing processes that are already universally employed in the industry to create cooling channels and heat dissipation structures. By utilizing existing fabrication techniques such as etching, drilling, and plating, the design achieves effective cooling without requiring specialized 3D printing or sintering equipment, thereby maintaining ease of manufacture while improving cooling performance.
Solution Approach 2:
The invention employs cost-effective materials and methods that can be manufactured using conventional PCB processes rather than expensive specialized techniques. The cooling structures are created using standard PCB layer materials and processes, making the solution economically viable for mass production without requiring investment in specialized fabrication equipment.
3Temperature
If embedded PCB designs are used for cooling, then thermal performance improves, but difficulty in connecting sub-circuits and mounting passive components increases
Solution Approach 1:
The invention segments the PCB into functional zones with dedicated cooling channels and heat dissipation areas while maintaining separate accessible surfaces for component mounting and sub-circuit connections. The cooling structures are integrated into specific PCB layers without blocking access to component areas, allowing independent optimization of thermal performance and assembly complexity.
Solution Approach 2:
The invention utilizes the vertical dimension of multi-layer PCB construction to place cooling channels and heat dissipation structures in internal layers while maintaining accessible surfaces for component mounting on external layers. This dimensional separation allows thermal management functions to be embedded without interfering with component assembly and sub-circuit connections on the PCB surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces thermal resistance and improves heat transfer, enabling better thermal management for high power electronics without the need for additional cooling components or complex assembly processes.
Implementation Method 1
The plurality of power pillars can extend through the first PCB, across the cooling path, and through the third PCB for conducting heat from the at least one heat generating component
Implementation Method 2
A second PCB is mounted to the first PCB. The second PCB defines a cooling path therein extending in a coolant flow direction from an inlet end of the cooling path to an outlet end of the cooling path
Data Source
AI summary
A printed circuit board (PCB) assembly includes a first PCB including at least one heat generating component. A second PCB is mounted to the first PCB. The second PCB defines a cooling path therein extending in a coolant flow direction from an inlet end of the cooling path to an outlet end of the cooling path. A plurality of power pillars extend from the first PCB and across the cooling path.