PCB X-Y Shielding via Copper Perimeter Bending
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for x-y shielding of signal paths in printed circuit boards (PCBs) are costly, time-consuming, and restrictive in terms of usable space and surface element characteristics, limiting the ability to maintain electromagnetic compatibility (EMC) in high-speed electronics.
Innovation Solution
A method involving the thermocompression of layers in a PCB stack, where resin layers conform to copper layers and bend around the perimeter, providing efficient x-y shielding without additional processing steps or surface area, allowing for the formation of a panel that shields inner layers effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If edge plating or stitching vias are used for x-y shielding, then electromagnetic compatibility is improved, but manufacturing cost and time increase
Solution Approach 1:
The copper layers are extended beyond the PCB edges during the lamination process, and the resin is forced to conform to these extended copper layers before final assembly. This preliminary configuration of shielding structures eliminates the need for subsequent edge plating or stitching via operations, reducing manufacturing complexity while maintaining EMC performance
Solution Approach 2:
The resin layers automatically conform to the extended copper layers during thermocompression, creating the shielding structure without requiring additional manual intervention or specialized equipment. The process uses existing materials and operations to achieve the shielding function
2Reliability
If edge plating is used for x-y shielding, then electromagnetic compatibility is improved, but usable space and surface area are reduced
Solution Approach 1:
Instead of adding shielding in the x-y plane through edge plating, the solution extends copper layers in the z-dimension (vertical stacking) and uses resin conformation to create shielding that wraps around the edges. This dimensional approach maintains surface area for signal traces while providing effective shielding
3Reliability
If additional plating processes are used for shielding, then electromagnetic compatibility is improved, but manufacturing time increases
Solution Approach 1:
The shielding function is merged with the existing lamination process. The copper layers are positioned and the resin is forced to conform during the same thermocompression step that bonds the PCB layers, combining shielding creation with the standard lamination operation to eliminate additional plating time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient x-y shielding of signal paths within PCBs, reducing manufacturing complexity and costs while maintaining electromagnetic compatibility, without the need for additional plating or extensive surface area dedication.
Implementation Method 1
thermocompressing the stack to form a panel such that the resin layers conform to the further copper layers and such that the copper layers bend around a perimeter of the inner layers
Data Source
AI summary
A method of making a printed circuit board is disclosed. The method includes forming a plurality of layers. The method further includes forming a stack including the plurality of layers such that topmost and bottommost layers of the stack are copper layers and such that inner layers of the stack include resin layers and further copper layers. The method further includes thermocompressing the stack to form a panel such that the resin layers conform to the further copper layers and such that the copper layers bend around a perimeter of the inner layers. The method further includes separating a printed circuit board from the panel such that the printed circuit board's widest extent defines its final width.