Integrated PCB Current Collector for Fuel Cell Thermal Management
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Solution Overview
Problem
Existing fuel cell systems face issues with high thermal conductivity in bus plates leading to thermal gradients and flooding, which are mitigated with additional components increasing complexity, weight, and space requirements, necessitating a more efficient and lightweight solution.
Innovation Solution
An integrated current collector and electrical component plate using a printed circuit board design with layers for current collection, insulation, and electrical components, such as resistors, to reduce thermal conductivity and incorporate heating and monitoring functions within a single, thin plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thick copper bus plates are used as current collectors, then electrical conductivity is improved, but thermal conductivity increases causing thermal gradients and flooding issues
Solution Approach 1:
The patent changes the material parameters by replacing solid copper with a printed circuit board structure that has copper traces separated by insulating material. This transforms the thermal and electrical conductivity characteristics while maintaining electrical functionality, thereby reducing thermal gradients while preserving electrical conductivity.
Solution Approach 2:
The patent employs a composite structure combining copper conductive traces with electrically insulating material layers in a printed circuit board. This composite approach allows selective optimization of electrical conductivity paths while providing thermal insulation to reduce thermal gradients and prevent flooding.
2Temperature
If additional heating components are added to mitigate thermal issues, then temperature control is improved, but device complexity increases
Solution Approach 1:
The patent merges the current collector function with the thermal management function into a single integrated printed circuit board structure. The insulating material layers serve dual purposes: electrical insulation and thermal management, eliminating the need for separate heating components and reducing overall system complexity.
Solution Approach 2:
The printed circuit board structure performs multiple functions simultaneously: current collection through copper traces, electrical insulation through material layers, and thermal management through the insulating structure. This multi-functionality replaces what would otherwise require separate dedicated components.
3Reliability
If multiple separate components are used for current collection and heating, then functional performance is improved, but weight increases
Solution Approach 1:
The patent combines multiple functional components (current collector, insulator, thermal management element) into a single integrated printed circuit board assembly. This consolidation maintains all necessary functions while significantly reducing the total weight compared to using separate discrete components.
4Reliability
If multiple separate components are used for current collection and heating, then functional performance is improved, but space requirements increase
Solution Approach 1:
The patent integrates current collection and thermal management functions into a single planar printed circuit board structure that occupies minimal space. The layered construction allows multiple functions to coexist in a compact footprint, eliminating the volume required for separate three-dimensional components.
5Reliability
If thick bus plates are used, then electrical conductivity is improved, but manufacturing efficiency decreases
Solution Approach 1:
The patent replaces traditional mechanical machining and assembly of thick copper bus plates with printed circuit board manufacturing processes. PCB technology enables precise copper trace deposition and layer lamination through automated manufacturing, significantly improving production efficiency while maintaining electrical conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design decreases thermal gradients, reduces flooding, and simplifies fuel cell systems by integrating multiple functions into a lightweight, space-efficient plate, minimizing the need for external heating components and enhancing manufacturing efficiency.
Implementation Method 1
the current collection layer is laminated to the first surface of the first insulation layer, and the electrical component layer is laminated between the second surface of the first insulation layer and the first surface of the second insulation layer
Implementation Method 2
an electrical component layer, comprising an electrical component having a first connection site and a second connection site
Data Source
AI summary
An integrated current collector and electrical component plate for a fuel cell stack is disclosed, comprising a printed circuit board comprising the following layers: a current collection layer, comprising a current collector; a first insulation layer, comprising a first surface and a second surface; an electrical component layer, comprising an electrical component having a first connection site and a second connection site; and a second insulation layer, comprising a first surface and a second surface, wherein the current collection layer is laminated to the first surface of the first insulation layer, and the electrical component layer is laminated between the second surface of the first insulation layer and the first surface of the second insulation layer. A fuel cell stack and methods for manufacturing a fuel cell stack comprising the integrated current collector and electrical component plate are also disclosed.