PCB Cutout Power Regulator Layout for Low-Loss IC Power Delivery
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Solution Overview
Problem
As integrated circuits become smaller and more powerful, there is a growing need to improve power efficiency and reduce power supply noise, which is exacerbated by increased power dissipation and current, while conventional power delivery methods result in significant power loss and thermal management challenges.
Innovation Solution
A circuit system where a power regulator is directly mounted on a printed circuit board and integrated circuit package, with direct soldering or pressure fitting, reducing power loss and enabling efficient thermal management through shared heat sinks and reduced routing requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If power regulators are distributed around the printed circuit board and connected through traces, then power can be delivered to the integrated circuit package, but significant power loss occurs in the trace routes
Solution Approach 1:
The patent extracts the power regulator from its conventional distributed position on the PCB and relocates it directly to the integrated circuit package. This removal of the intermediary trace route eliminates power loss in routing while simplifying the overall power delivery architecture.
Solution Approach 2:
The patent introduces a substrate as an intermediary carrier that holds the power regulator in close proximity to the integrated circuit package. This intermediary structure enables direct coupling while maintaining manufacturability through standard PCB assembly processes.
2Temperature
If conventional power delivery methods are used with distributed power regulators, then power can be supplied to the integrated circuit, but thermal management becomes challenging
Solution Approach 1:
The patent merges the power regulator with the integrated circuit package by placing them in close proximity on a shared substrate. This consolidation enables unified thermal management where heat from both components can be dissipated through common thermal pathways, simplifying the thermal regulation system.
3Power
If multiple power planes are used on the PCB for distributed power regulators, then power delivery is achieved, but the PCB becomes more complex with increased routing requirements
Solution Approach 1:
The patent extracts the power regulator from the distributed PCB architecture and relocates it to the integrated circuit package. This eliminates the need for multiple power planes and complex routing across the PCB, as power is delivered directly at the source.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces power loss and improves thermal regulation by directly delivering power, allowing for a lower profile and simplified thermal management, while minimizing the need for multiple power planes on the PCB.
Implementation Method 1
a power regulator connected to power terminals of the integrated circuit package through a cutout in the printed circuit board
Implementation Method 2
improving thermal regulation by enabling heat transfer from the power regulator through the integrated circuit package to a heat sink
Data Source
AI summary
A circuit system includes an integrated circuit package mounted on a first side of a printed circuit board and a power regulator connected to power terminals of the integrated circuit package through a cutout in the printed circuit board. The power regulator draws power from the printed circuit board by way of connections on a shelf region extending beyond an area of the cutout. A method of manufacturing a printed circuit board includes forming a cutout in the printed circuit board, the cutout having an area less than a footprint of an integrated circuit package, mounting the integrated circuit package over the cutout on a first side of the printed circuit board, coupling a power regulator to power terminals of the integrated circuit package through the cutout, and interfacing the power regulator to a power plane of the printed circuit board by way of a shelf region extending beyond the area of the cutout on a second side of the printed circuit board.