Circuit Board Assembly With Embedded Components Under B2B Connector
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Solution Overview
Problem
Electronic elements on the periphery of board-to-board connectors in circuit boards are prone to damage during production, assembly, and repair due to impact, leading to poor functionality.
Innovation Solution
A circuit board assembly design that incorporates a backing plate with an accommodation portion, such as a blind via, to house electronic elements under the board-to-board connector, providing protection and space-saving benefits, with optional shielding and conductive layers for electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic elements are disposed on the surface of the circuit board surrounding the board-to-board connector, then filtering functions are achieved, but the electronic elements are easily damaged due to impact during production, assembly, and repair
Solution Approach 1:
The patent moves electronic elements from the traditional planar surface mounting to a three-dimensional configuration by placing them within cavities or recesses of the circuit board. This spatial repositioning in the vertical dimension protects elements from lateral impact forces while maintaining their electrical connection and functional performance
Solution Approach 2:
The patent embeds electronic elements within cavity structures formed in the circuit board substrate. These nested configurations allow elements to be housed inside protective recesses, effectively shielding them from external mechanical impacts during handling, assembly, and repair operations
2Reliability
If electronic elements are accommodated in cavities of the circuit board, then impact protection is provided, but manufacturing complexity increases
Solution Approach 1:
The circuit board is divided into multiple layers with cavities formed by removing material from specific regions. This segmentation approach allows standard PCB manufacturing techniques to create protective recesses without requiring entirely new manufacturing processes, balancing protection benefits with manufacturing feasibility
3Reliability
If electronic elements are placed on the circuit board surface, then filtering functions are achieved, but space utilization is inefficient
Solution Approach 1:
The patent transitions from two-dimensional surface mounting to three-dimensional cavity integration, utilizing the vertical depth of the circuit board structure. This enables electronic elements to be positioned within the board thickness rather than occupying precious surface area, thereby improving space utilization while maintaining filtering functionality
Data Source
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AI summary
This application relates to the field of electronic component technologies, and in particular, to a circuit board assembly and an electronic device. The circuit board assembly includes a circuit board, a backing plate, an electronic element, and a board-to-board connector. The backing plate is fixedly connected to one side of the circuit board, the backing plate is provided with an accommodation portion, and the electronic element is accommodated in the accommodation portion and connected to the circuit board. The board-to-board connector is fixedly connected to one side that is of the backing plate and that is away from the circuit board. In the circuit board assembly and the electronic device provided in this application, the electronic element is accommodated in the accommodation portion, and the accommodation portion is provided on the backing plate, so that the electronic element is located in the space under the board-to-board connector. Therefore, not only damage caused by impact of the electronic element can be prevented, but also space of the circuit board assembly can be greatly saved, thereby facilitating miniaturization and thinning of the electronic device.