Cross-Talk/Noise/Interference Reduction TRIZ Cases
- Shielded Module Grounding Structure With Columnar Conductor
A columnar conductor routed through an opening in the resin and shield stack enables reliable grounding and stronger module shielding.
- Sandwich Power Module Layout for Dense PCB Current Delivery
Metal-wrapped inductor modules route power through inductor legs to cut PCB footprint and trace impedance while improving cooling and current density.
- Stretchable Composite Antenna for Stable Resonant Frequency
A composite substrate with metal oxide dielectric clusters keeps antenna frequency in range during stretching while preserving thermal conductivity.
- Flexible Transmission Line Structure for Stable Void Impedance
Upper cavities and localized insulator support keep voids stable in flexible transmission lines, preserving impedance, flexibility, and EMI shielding.
- Laminated Transmission Line Layout for Bending and Low Radiation
A thinner offset center section and coplanar conductor layout let a laminated transmission line bend in tight spaces while limiting radiation.
- Multilayer Substrate Via Layout for Low-Resistance High-Frequency Signals
Parallel via rows offset across the signal line widen current paths and cut resistance and parasitic capacitance in high-frequency multilayer substrates.