Sandwich Power Module Layout for Dense PCB Current Delivery
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Solution Overview
Problem
The challenge of integrating high-current power converters into smaller form factors for modern GPUs and CPUs is exacerbated by heat conduction issues and the need for high-power density and efficient heat dissipation, which existing power supply modules struggle to address effectively.
Innovation Solution
A sandwich structure power supply module is designed with inductors and power switches integrated on a PCB, featuring a magnetic core with passageways for windings and metal layers connected to different potentials, minimizing PCB footprint and trace impedance, and utilizing hybrid magnetic core materials for optimal inductance and current handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional power supply modules are used, then the structure is simple and ease of manufacture is good, but the PCB footprint is large and power density is low
Solution Approach 1:
The patent merges the inductor and power switch components into a single integrated module mounted on the PCB. The inductor pack includes the magnetic core with windings, and the power switch chip is positioned adjacent to it, with their leads interconnected. This integration reduces the overall PCB footprint by eliminating separate component mounting areas and interconnecting traces, while maintaining manufacturing simplicity through standardized mounting procedures.
Solution Approach 2:
The patent utilizes three-dimensional spatial arrangement by stacking components vertically on the PCB rather than spreading them out horizontally. The inductor pack is mounted with its magnetic core extending perpendicular to the PCB surface, and the power switch chip is positioned on the same vertical plane. This dimensional transition from 2D to 3D layout significantly reduces the PCB footprint while preserving ease of manufacture through conventional SMT techniques.
2Power
If higher current is used to achieve better processor performance, then processing power is improved, but heat conduction becomes more difficult and heat dissipation challenges increase
Solution Approach 1:
The patent introduces a thermal interface material as an intermediary between the power switch chip and the PCB heat sink area. This thermal paste or pad fills the gaps and micro-voids between the chip packaging and the PCB copper planes, improving thermal contact and facilitating heat transfer from the high-current power switches to the PCB's thermal management structures, thereby addressing heat dissipation challenges while maintaining high processor performance.
Solution Approach 2:
The patent incorporates thermal vias with copper plating in the PCB layers beneath the power switch chip. These vias act as thermal conduits that conduct heat away from the power switches through the PCB substrate to external heat sinks or cooling structures. The copper material's high thermal conductivity and controlled thermal expansion properties ensure effective heat dissipation while maintaining structural integrity under thermal cycling conditions associated with high-current operation.
3Volume of moving object
If smaller size is used for microprocessor, then integration is improved, but heat conduction capability deteriorates
Solution Approach 1:
The patent employs liquid thermal interface material (thermal paste) in the gap between the power switch chip and the PCB heat dissipation structures. This liquid filler compensates for surface irregularities and ensures optimal thermal contact in the compact integrated design, enabling effective heat conduction from the high-density power components to the PCB's thermal management system despite the reduced overall size of the microprocessor package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances load current/power density, improves efficiency by delivering current through inductor legs, and benefits from top-side cooling, while maximizing inductance and minimizing conduction losses, thus supporting high-performance computing applications.
Implementation Method 1
two metal layers are connected to different potentials
Implementation Method 2
a magnetic core having two passageways passing through the magnetic core from a top surface to a bottom surface; two windings respectively passing through the two passageways
Data Source
AI summary
A power supply module having at least one inductor modules, a top PCB mounted on top of the at least one inductor modules, and at least one pair of power device chips mounted on top of the top PCB, wherein power pins and signal pins for connecting the top PCB and a board that the at least one inductor modules are attached to, are implemented by metal layers wrapping each of the at least one inductor modules.