Shielded Module Grounding Structure With Columnar Conductor

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Solution Overview

Problem

Existing sealing laminate sheets face challenges in ensuring reliable grounding connection and maintaining high shielding performance due to limitations in grounding the electrically conductive material.

Innovation Solution

A module configuration that includes a substrate with components covered by a resin film and a shield film, featuring a first opening for a columnar conductor to pass through, allowing easy and reliable grounding by connecting the shield film to the conductor.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a hole for grounding connection is provided in the first layer to expose the electrically conductive material, then grounding connection is enabled, but reliable grounding connection cannot be ensured and degree of freedom in grounding connection is low

Engineering Contradiction:
Improvegrounding connection reliabilityVSAvoidgrounding connection flexibility
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent transitions from a two-dimensional planar grounding connection (hole in first layer) to a three-dimensional columnar conductor extending vertically through multiple layers. The columnar conductor rises from the electrically conductive material, passes through the first layer, and terminates at a height above the first layer, enabling grounding connections from multiple spatial dimensions and improving both reliability and flexibility.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The columnar conductor is pre-formed and positioned within the sealing laminate sheet before final assembly. This preliminary preparation of the grounding path allows for easier and more reliable connection to the electrically conductive material, eliminating the need for complex post-assembly grounding procedures and enhancing both reliability and design freedom.

Inventive Principle:
Principle #10Preliminary action

2Object-affected harmful factors

If electrically conductive material is included in sealing laminate sheet for shielding, then shielding performance is improved, but grounding becomes difficult and complex

Engineering Contradiction:
Improveshielding performanceVSAvoidgrounding system complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent combines the shielding function (electrically conductive material in second layer) and grounding function (columnar conductor) into a single integrated structure. The columnar conductor serves dual purposes: it provides the grounding path and simultaneously acts as a connection element that simplifies the overall grounding system, reducing complexity while maintaining effective shielding.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The columnar conductor acts as an intermediary element between the electrically conductive material (shielding layer) and the external grounding point. This mediator simplifies the connection process by providing a dedicated, pre-positioned pathway for grounding current, eliminating the need for complex routing through multiple layers and components.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS12446157B2Module
Publication Date: 2025.10.14 MURATA MFG CO LTD
  • US12446157B2 patent drawing
  • US12446157B2 patent drawing
  • US12446157B2 patent drawing

AI summary

A module includes a substrate having a first surface, components as one or more components mounted on the first surface, a resin film covering the one or more components along a shape of the one or more components and covering part of the first surface, a first shield film formed to overlap the resin film, and a first sealing resin as a sealing resin disposed to cover the first surface, the one or more components, and the first shield film. A stack including the resin film and the first shield film has a first opening. A first columnar conductor is disposed to be electrically connected to the first surface through the first sealing resin and the first opening. The first shield film is electrically connected to the first columnar conductor in the first opening.