PCB EMI Shielding via Integrated Insulating Dam and Conductive Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing EMI shielding structures for portable electronic devices face challenges in miniaturization and integration due to the need for separate press-processing of shield cans, which increases material costs and reduces integration ratios of circuit elements.
Innovation Solution
An EMI shielding structure comprising a printed circuit board with an insulating dam and member, covered by a shielding layer formed from electroconductive material, allowing for a two-stage manufacturing process that maintains a thin, uniform shielding layer without increasing the spacing between circuit elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If shield cans are used for EMI shielding, then EMI shielding performance is improved, but device complexity and manufacturing cost increase due to separate press processing
Solution Approach 1:
The patent merges the EMI shielding function with the PCB manufacturing process by forming a shielding layer directly on the PCB during the same manufacturing steps used to create the insulating dam and insulating member. This eliminates the need for separate shield can components and their associated press processing, thereby reducing device complexity while maintaining EMI shielding performance.
Solution Approach 2:
The PCB structure is designed to serve multiple functions: it provides the insulating dam, insulating member, and EMI shielding layer all in one integrated structure. The shielding layer is formed using the same manufacturing processes (photoresist coating, patterning, etching) that create other PCB features, making the PCB a multi-functional component that reduces overall device complexity.
2Reliability
If shield cans are mounted on PCB, then EMI shielding is achieved, but area for circuit elements is reduced due to spacing requirements
Solution Approach 1:
The EMI shielding function is merged into the PCB structure itself rather than being implemented as separate mounted components. The shielding layer is formed integrally with the insulating dam and insulating member during the same manufacturing process, eliminating the need for additional spacing to accommodate separate shield can mounts and thereby maximizing the area available for circuit elements.
Solution Approach 2:
Instead of adding EMI shielding in the horizontal plane through separate mounted components that require spacing, the patent implements shielding in the vertical dimension by forming a shielding layer on the PCB surface and extending it upward. This dimensional approach allows shielding without consuming horizontal space that would otherwise be available for circuit elements.
3Reliability
If separate press processing is performed for shield cans, then EMI shielding structure is formed, but manufacturing cost increases
Solution Approach 1:
The patent combines the EMI shielding layer formation with the existing PCB manufacturing process steps for creating the insulating dam and insulating member. All three structures are formed in the same sequence using the same equipment (photoresist coating, patterning, etching), eliminating the need for separate press processing of shield cans and thereby reducing manufacturing cost.
Solution Approach 2:
The PCB manufacturing process is designed to perform multiple functions simultaneously: forming the insulating dam, insulating member, and EMI shielding layer all in one integrated process flow. This multi-functionality eliminates the need for additional dedicated processing steps for shield can fabrication and assembly, reducing overall manufacturing cost.
4Reliability
If shield cans are used, then EMI shielding is provided, but weight of the device increases
Solution Approach 1:
The EMI shielding function is merged into the PCB structure, eliminating the need for separate shield can components. The shielding layer is formed as a thin film directly on the PCB, which significantly reduces the weight compared to traditional metallic shield cans while maintaining the required EMI shielding performance.
Solution Approach 2:
The patent uses a thin film shielding layer formed by deposition or spraying techniques instead of thick metallic shield cans. This thin film approach provides the necessary EMI shielding while minimizing the added weight, enabling weight reduction in portable devices without sacrificing shielding effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient EMI shielding with reduced material costs and improved integration ratios of circuit elements, facilitating miniaturization and weight reduction in portable devices.
Implementation Method 1
a shielding layer covering outer surfaces of the insulating dam and the insulating member
Implementation Method 2
The shielding layer may be formed of an electroconductive material sprayed in an atomizing form and have a predetermined thickness
Data Source
AI summary
An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a printed circuit board (PCB), a plurality of elements mounted on a region of the PCB, an insulating dam provided on a peripheral portion of the region of the PCB and covering a portion of the plurality of elements; an insulating member provided on a remaining portion of the region the PCB that is surrounded by the insulating dam and covering a remaining portion of the plurality of elements; and a shielding layer covering outer surfaces of the insulating dam and the insulating member.