PCB Electrostatic Discharge Pattern for Cutting Damage Prevention

Solution Overview

Problem

During the process of cutting a serially arranged printed circuit board, physical impact can damage semiconductor packages due to static electricity generated from the collision of cutting tools with insulation and pattern layers, leading to reduced reliability and yield of devices.

Innovation Solution

A printed circuit board design featuring alternately stacked insulation and pattern layers, with an electrostatic discharge pattern in the bridge area between device and peripheral areas, which is electrically floated and connected to a constant voltage source to discharge static electricity during cutting, preventing damage to semiconductor packages.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If cutting tools are used to cut the serially arranged PCB, then the PCB can be separated into individual devices, but static electricity generated from collision damages semiconductor packages

Engineering Contradiction:

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent introduces an electrostatic discharge pattern that converts the harmful static electricity generated during cutting into a beneficial discharge path. The pattern provides a controlled route for static electricity to dissipate safely, transforming the harmful collision-induced static charge into a protected discharge process that prevents damage to semiconductor packages while maintaining cutting efficiency

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The electrostatic discharge pattern acts as an intermediary element between the cutting tool and the semiconductor packages. It provides a intermediate discharge path that mediates the interaction between the mechanical cutting process and the sensitive electronic components, allowing static electricity to be discharged through a controlled pathway rather than directly affecting the semiconductor packages

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If the peripheral area is physically separated from the device area, then manufacturing flexibility is improved, but static electricity damages semiconductor packages during separation

Engineering Contradiction:

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The electrostatic discharge pattern is pre-configured in the bridge area before the physical separation process begins. This preliminary arrangement ensures that the discharge path is already in place and ready to handle static electricity as soon as separation is initiated, preventing damage before it can occur during the separation process

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The pattern converts the harmful static electricity generated during peripheral area separation into a beneficial controlled discharge. By providing a predetermined discharge path in the bridge area, the harmful electrostatic charge is transformed into a safe discharge process that occurs away from the semiconductor packages, enabling flexible separation while maintaining package integrity

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The electrostatic discharge pattern effectively reduces or prevents static electricity transfer to semiconductor packages, enhancing the reliability and yield of devices by protecting them from physical impact during the cutting process.

Implementation Method 1

an electrostatic discharge pattern which is configured to discharge static electricity when the peripheral area is physically separated from the device area

Methodology Applied

Scientific EffectElectrostatic Discharge: Electrostatic Discharge

Implementation Method 2

The electrostatic discharge pattern effectively reduces or prevents static electricity transfer to semiconductor packages

Methodology Applied

Scientific EffectElectrical Conduction: Conduction (electrical)

Data Source

PatentUS10212808B2Printed circuit board

Publication Date: 2019.02.19

AI summary

Disclosed is a printed circuit hoard. The printed circuit board includes a plurality of insulation layers and a plurality of pattern layers alternately stacked. The printed circuit board includes a plurality of device areas on which semiconductor packages are mounted and a peripheral area adjacent the device areas. An electrostatic discharge pattern is in a respective pattern layer among the plurality of pattern layers and is disposed at a boundary region between a respective device area of the plurality of device areas and the peripheral area.