PCB Fluid Guide Rails for Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional printed circuit boards face challenges in heat dissipation due to miniaturization and increased operating frequencies of electronic devices, leading to reduced reliability of semiconductor components.
Innovation Solution
A printed circuit board design featuring a core substrate with vertically laminated through holes and guide rails that facilitate fluid flow to transmit heat generated by semiconductor devices to the outside, utilizing heat conductive materials and electroplated metal layers for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor components are increased in quantity and operating frequency is increased, then processing power and functionality are improved, but heat generation increases and reliability decreases
Solution Approach 1:
The heat dissipation system is segmented into multiple independent channels: first through holes for semiconductor devices, second through holes for heat dissipation, and guide rails forming fluid flow paths. This segmentation allows heat from multiple sources to be dissipated through dedicated channels, improving overall heat management effectiveness while maintaining high component density.
Solution Approach 2:
A fluid medium is introduced as an intermediary to transfer heat from the semiconductor components through the core substrate to external cooling systems. The fluid flows through the guide rails and through holes, absorbing heat internally and dissipating it externally, thereby protecting the semiconductor components from excessive heat while maintaining high operating frequencies.
2Ease of manufacture
If conventional packaging methods (FC or WB) are used, then semiconductor devices can be assembled, but circuit layout design becomes difficult due to miniaturization
Solution Approach 1:
The patent transitions from conventional surface-mounted packaging (FC or WB methods) to a three-dimensional embedded structure. Semiconductor devices are embedded within the core substrate with through holes extending vertically, allowing circuit connections to be made in multiple dimensions. This dimensional change simplifies circuit layout design by providing direct vertical access to components while maintaining compact form factor.
3Reliability
If heat dissipation structures are added to improve cooling, then reliability is improved, but device complexity increases
Solution Approach 1:
The through holes and guide rails serve multiple functions simultaneously: they provide fluid flow paths for heat dissipation, act as structural support elements within the core substrate, and enable electrical connections between different layers. This multi-functionality reduces the need for separate dedicated heat dissipation components, thereby improving cooling effectiveness while limiting increases in structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cooling efficiency and reliability by effectively transmitting heat away from semiconductor devices, allowing for increased packaging density and improved performance in high-frequency applications.
Implementation Method 1
heat generated from a semiconductor device disposed in the first through hole is transmitted to the outside of the printed circuit board
Data Source
AI summary
The invention provides a printed circuit board and a method for fabricating the same. The printed circuit board includes a core substrate having a first surface and an opposite second surface. A first through hole and a second through hole are formed through a portion of the core substrate, respectively from the first surface and second surfaces, wherein the first and second through holes are laminated vertically and connect to each other. A first guide rail and a second guide rail are, respectively, formed through a portion of the core substrate and connected to the second through hole, so that a fluid flows sequentially from an outside of the printed circuit board through the first guide rail, the second through hole and the second guide rail, to the outside of the printed circuit board.