Grounding Metallic Piece for PCB Stack Assembly
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Solution Overview
Problem
Existing electronic device grounding solutions are costly and not modular, requiring complex manual interventions and dedicated components for effective electrostatic discharge and electromagnetic compatibility, especially in devices with plastic casings and sensitive modules.
Innovation Solution
A system using a metallic piece with a perpendicular wall and parallel base that matches the footprint of a first electronic board, allowing for integrated assembly and soldering, providing electrical connection between the first and second ground planes, and optionally serving as a shielding component, enabling flexible and cost-effective grounding of multiple electronic boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex grounding components (self-adhesive seals, metallic clips, conductive foam) are used to ensure effective grounding, then grounding reliability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the grounding function with the existing PCB structure by creating an integrated grounding system where the grounding trace is directly formed on the PCB board rather than using separate grounding components. This integration eliminates the need for additional metallic clips, self-adhesive seals, or conductive foam, thereby reducing device complexity while maintaining grounding reliability through direct electrical connection.
Solution Approach 2:
The PCB structure serves multiple functions: it provides both the grounding trace for electrical connection and the structural support for mounting components. The grounding trace is formed as part of the PCB's conventional layers, allowing the same structure to fulfill both electrical grounding and mechanical support roles, thus eliminating dedicated grounding components.
2Reliability
If dedicated grounding components are used, then grounding effectiveness is improved, but manufacturing cost increases
Solution Approach 1:
The grounding function is merged into the PCB manufacturing process itself. The grounding trace is created using the same PCB fabrication techniques (copper traces, solder mask, silkscreen) that are already used for other circuit elements, eliminating the need for separate grounding components and their associated procurement, inventory, and assembly costs.
Solution Approach 2:
The PCB structure performs both grounding and component mounting functions. By forming the grounding trace as part of the PCB's conventional structure, the design eliminates dedicated grounding components, reducing BOM (Bill of Materials) costs and simplifying the manufacturing process while maintaining effective grounding.
3Manufacturing precision
If manual intervention is used for grounding assembly, then grounding precision is improved, but productivity decreases
Solution Approach 1:
The grounding trace is integrated into the PCB structure during automated PCB fabrication processes. The grounding connection is established through automated pick-and-place machines or reflow soldering processes that are already part of the conventional PCB assembly line, eliminating the need for manual grounding assembly while maintaining precise grounding connections through automated placement and soldering.
Solution Approach 2:
The PCB structure serves as both the circuit board and the grounding system. The grounding trace is formed using the same automated processes that create other PCB features, allowing grounding assembly to be performed simultaneously with other component placements using existing automated equipment, thus maintaining productivity without sacrificing grounding precision.
4Adaptability or versatility
If plastic casing is used, then design flexibility is improved, but grounding capability deteriorates
Solution Approach 1:
The grounding function is merged into the PCB structure itself rather than relying on the casing material. The grounding trace is formed on the PCB board and provides the return path for electrical signals, eliminating the dependence on metallic casing for grounding. This allows the use of plastic casings for design flexibility while maintaining effective grounding through the PCB-integrated trace.
Solution Approach 2:
The PCB structure provides both the electrical grounding path and the mounting surface for components. By forming the grounding trace on the PCB, the design achieves grounding capability independent of the casing material, enabling the use of plastic casings for aesthetic and design flexibility while the PCB handles all grounding requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies and cost-reduces the grounding process, ensuring effective electrostatic discharge protection and electromagnetic compatibility in modular electronic devices, even those with plastic casings, by using a reusable metallic piece that integrates seamlessly into existing assembly lines.
Implementation Method 1
the base comprises elements providing a contact with the second electronic board thus electrically connecting the second ground plane with the first ground plane
Implementation Method 2
The metallic piece is assembled and soldered on the first electronic board
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
The invention relates to a system for grounding in a electronic device comprising a first electronic board (100), this latter comprising a first ground plane and at least one footprint (101) intended to connect the first ground plane to a component, the at least one footprint (101) defining a closed line on said first electronic board (100) adapted to connect the component, at least a second electronic board (111) comprising a second ground plane, the second electronic board being superposed on the first electronic board, a grounding metallic piece (103) comprising a wall (104) perpendicular to said first electronic board and a base (106) parallel to said first electronic board. The system being notable in that the metallic piece (103) is dimensioned such that the wall (104) corresponds to a perpendicular projection of said closed line defined by one of the at least one footprints (101) and such that the shape of base corresponds to the shape defined by the closed line, and in that the base (103) comprises elements (105, 107) providing a contact with the second electronic board thus electrically connecting the second ground plane with the first ground plane. The elements providing a contact with the second electronic board are for example contact strips (105) or balls (107).