PCB Insulating Walls Prevent Bridge Short-Circuits
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The miniaturization and performance improvements of semiconductors in flip-chip mounting have increased the difficulty of forming solder bumps and led to a higher risk of bridge short-circuits, requiring a solution to enhance manufacturing ease and reliability of printed circuit boards.
Innovation Solution
A printed circuit board design featuring insulating walls surrounding the side surfaces of pads to prevent bridge short-circuits, with a manufacturing method that includes forming pads and conductive patterns on a carrier substrate, embedding them in an insulating layer, and removing the carrier substrate to create recesses that reduce the risk of bridge short-circuits and improve adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the interval between connection terminals is decreased for high-density mounting, then the mounting density is improved, but the risk of bridge short-circuit increases and manufacturing precision becomes more difficult to achieve
Solution Approach 1:
The patent introduces insulating walls that segment the space around each pad, creating physical barriers between adjacent connection terminals. These walls divide the continuous solder resist area into isolated sections, preventing solder from bridging between closely spaced pads while maintaining high mounting density
Solution Approach 2:
The insulating walls act as intermediary elements between adjacent pads, providing a non-conductive barrier that prevents direct electrical contact between solder joints. This intermediary structure allows close spacing of terminals while maintaining electrical isolation and preventing bridge short-circuits
2Quantity of substance
If the interval between connection terminals is decreased for high-density mounting, then the mounting density is improved, but the manufacturing precision becomes more difficult to achieve
Solution Approach 1:
The insulating walls segment the solder resist structure into discrete units around each pad, eliminating the need for precise continuous pattern formation. Each wall can be independently formed with standard precision, making manufacturing easier even when pad spacing is reduced for high-density mounting
3Reliability
If insulating walls are added to surround pad side surfaces, then the bridge short-circuit risk is decreased, but the device complexity increases
Solution Approach 1:
The insulating walls are merged with the solder resist layer, forming an integrated structure rather than separate components. The walls are formed as protrusions from the same insulating material that provides the solder resist function, combining structural support and electrical isolation in a single element
Solution Approach 2:
The insulating walls serve multiple functions simultaneously: they provide electrical isolation between adjacent pads, act as physical barriers to prevent solder bridging, and maintain the structural integrity of the solder resist layer. This multi-functionality reduces the need for additional separate components
Data Source
AI summary
The present disclosure relates to a printed circuit board and a method of manufacturing the same. The printed circuit board includes: an insulating layer; a plurality of pads disposed on the insulating layer; and a plurality of insulating walls that are disposed on the insulating layer and cover side surfaces of the plurality of pads, respectively, but are not disposed on upper surfaces of the plurality of pads. The plurality of insulating walls are disposed to be spaced apart from each other on the first insulating layer.