Printed circuit board, electronic component-embedded substrate, and manufacturing method thereof
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Solution Overview
Problem
Existing printed circuit boards face challenges in reducing size and process complexity due to the need for additional layers and processes to form cavities for embedded electronic components, which can lead to misalignment issues and increased costs.
Innovation Solution
A printed circuit board design utilizing a barrier layer with a lower modulus than the insulating layers, such as a primer resin, to facilitate cavity formation without the need for separate pattern or protective layers, reducing misalignment and process complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a cavity structure is formed in the printed circuit board to embed electronic components, then the board size can be reduced, but additional layers and processes are required which increases process complexity and may lead to misalignment issues
Solution Approach 1:
The barrier layer is merged with the insulating layer structure, serving dual functions as both an insulating layer and a barrier layer that defines the cavity. This eliminates the need for separate pattern layers and protective layers, reducing process complexity while maintaining the cavity structure for electronic component embedding
Solution Approach 2:
The barrier layer performs multiple functions: it acts as an insulating layer, defines the cavity boundary, and serves as a reference for alignment. This multi-functionality reduces the number of separate components and processes needed, thereby reducing overall process complexity
2Adaptability or versatility
If additional layers are added to form cavities for embedded components, then electronic components can be embedded, but manufacturing costs increase
Solution Approach 1:
By combining the barrier layer with the insulating layer, the patent eliminates the need for separate pattern layers and protective layers. This merging reduces the total number of manufacturing steps and materials required, thereby lowering manufacturing costs while still enabling electronic component embedding
3Shape
If separate pattern or protective layers are used to form cavities, then cavity structure can be defined, but misalignment issues occur
Solution Approach 1:
The barrier layer is merged with the insulating layer, eliminating separate pattern layers that could cause misalignment. The integrated structure ensures that the cavity boundaries are defined by a single reference plane, improving alignment precision
Solution Approach 2:
The barrier layer is formed as part of the insulating layer structure during the manufacturing process, establishing the cavity boundaries in advance. This preliminary formation of the reference structure ensures accurate alignment for subsequent steps
Data Source
AI summary
A printed circuit board and an electronic component-embedded substrate including the same are provided. The printed circuit board includes a first insulating layer, a second insulating layer disposed on the first insulating layer, a barrier layer disposed between the first and second insulating layers, a cavity penetrating through one of the first and second insulating layers, and a first wiring layer at least partially in contact with the barrier layer. The barrier layer has a modulus lower than a modulus of each of the first and second insulating layers.