Multi-Layer PCB Contact via Offset Cutouts
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Solution Overview
Problem
Conventional contact arrangements for multi-layer circuit carriers face challenges in efficiently and reliably handling high-current applications, often resulting in power losses and increased ohmic resistance due to the use of current-carrying layers, which can limit the transmission of higher currents and are not tolerant to wire misalignment.
Innovation Solution
The contact arrangement features at least two cutouts on different sides of an internal wire, with their center axes positioned at a predetermined distance from the wire's center line, allowing direct external contacting without a current-carrying layer, enabling independent arrangement of internal and external contact areas and minimizing power losses through cold welding or soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a current-carrying layer is used to contact the internal wire, then the circuit carrier can be manufactured with standard processes, but power losses increase and current transmission capability is limited
Solution Approach 1:
The patent extracts and removes the current-carrying layer from the contact arrangement, allowing direct contact with the internal wire through recesses. This eliminates the intermediate layer that caused power losses and ohmic resistance, while the recesses provide the necessary structural access to the wire for direct electrical connection.
2Reliability
If a current-carrying layer is used for external contacting, then manufacturing is simplified, but higher current transmission is limited and ohmic resistance increases
Solution Approach 1:
The patent segments the contact arrangement into multiple recesses positioned at different locations around the wire. This segmentation allows the contact points to be distributed, reducing the impact of wire positioning tolerances and misalignments. The multiple contact points work together to transmit high currents reliably even when the wire position varies within tolerance ranges.
3Manufacturing precision
If the contact area is concentrated in one region, then manufacturing is easier, but constriction occurs leading to increased ohmic resistance
Solution Approach 1:
The patent transitions from a concentrated contact area in one region to a distributed contact arrangement across multiple dimensions. The recesses are positioned at different locations around the wire, creating a spatial distribution of contact points. This dimensional distribution prevents constriction of current flow and reduces ohmic resistance while maintaining manufacturing feasibility through standardized recess formation processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables reliable high-current external contacting with reduced power losses and improved temperature resistance, allowing for higher current transmission while accommodating wire misalignment and preventing constriction-related ohmic resistance issues.
Implementation Method 1
during pressing, a metallurgical bond can be created with the sleeve or the electrically conductive wall due to cold welding
Implementation Method 2
During soldering, direct access can be achieved via the solder
Data Source
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AI summary
The invention relates to a contact arrangement (30) for a multi-layer circuit board (1a), said circuit board (1a) having at least one inner wire (2) which is contacted via at least one cutout (10). According to the invention, at least two cutouts (10) are arranged on different sides of the at least one inner wire (2), the center axes (2) of the at least two cutouts (10) having a predefined distance (as) to a target center line (2.4) of the at least one inner wire (2). The at least two cutouts (10) expose the at least one inner wire (2) in at least two contact zones (2.1) for the purpose of contact, said contact zones being arranged on different sides of the wire (2).