Transparent Adhesive Window for PCB Optoelectronic Integration
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Solution Overview
Problem
Current methods fail to effectively integrate optoelectronic components into the cross-section of printed circuit boards while ensuring optical communication, as they require a transparent surface for functioning.
Innovation Solution
A method involving the application of a transparently curable adhesive layer to a carrier layer, embedding an optoelectronic component, curing the adhesive to form a window element, and structuring the carrier to expose the window, allowing optical communication between the component and the environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If optoelectronic components are integrated into the cross-section of a printed circuit board, then compact configuration and mechanical/chemical protection are improved, but optical communication capability deteriorates due to lack of transparent surface
Solution Approach 1:
The patent segments the adhesive layer into two functional parts: a first adhesive layer for mechanical bonding and a second transparently curable adhesive layer for forming the optical window. This segmentation allows each layer to fulfill its specific function - structural support and optical transmission respectively - resolving the contradiction between compact integration and optical communication capability
Solution Approach 2:
The transparent adhesive layer serves multiple functions simultaneously: it acts as a bonding agent to secure the optoelectronic component, provides mechanical protection to the component, and forms a transparent window for optical signal transmission. This multi-functionality resolves the contradiction by integrating both protection and optical communication functions into a single structural element
2Reliability
If a transparent adhesive layer is used to form a window element, then optical communication is improved, but manufacturing complexity increases due to additional curing steps
Solution Approach 1:
The patent merges the bonding function and optical window formation function into a single transparent adhesive layer that performs both roles. This eliminates the need for separate bonding and window formation steps, reducing manufacturing complexity while maintaining optical communication capability
Solution Approach 2:
The adhesive layer undergoes a parameter change from transparent (uncured) to opaque/colored (cured) state through UV curing or thermal curing. This parameter change allows the same material to provide both optical transmission when needed and structural integrity/protection when cured, simplifying the manufacturing process while ensuring both optical communication and component protection
3Reliability
If the carrier layer is structured to expose the window element, then optical communication is improved, but mechanical protection deteriorates due to reduced coverage
Solution Approach 1:
The carrier layer is selectively structured only in the area where the optical window element is located, while the rest of the carrier layer remains intact to provide mechanical protection. This local structuring approach allows optical communication through the window area while maintaining overall structural integrity and mechanical strength of the circuit board assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the integration of optoelectronic components like LEDs, photodiodes, and DLPs within printed circuit boards with a transparent window element for efficient light emission and detection, enhancing miniaturization and protection while maintaining mechanical and chemical integrity.
Implementation Method 1
a) applying a transparently curable adhesive layer to a carrier layer b) placing at least one optoelectronic component with an optically relevant side of the component on the adhesive layer c) curing the adhesive layer to form a window element
Data Source
Figure 1a~1d
Figure 1e~1g
Figure 2a~2c
AI summary
The invention relates to a method for producing a circuit board having at least one optoelectronic component, which method is characterized by the following steps: a) applying a transparent curable adhesive layer (1) to a carrier layer (2), b) placing at least one optoelectronic component (3) onto the adhesive layer (1) by means of an optically relevant side (4) of the component, c) curing the adhesive layer (1) into a window element (1'), d) embedding the component (3) in a circuit-board composite, e) structuring the carrier layer (2) in order to at least partially expose the window element (1') and to contact the component (3).